Part Details for MS2209 by Microsemi Corporation
Overview of MS2209 by Microsemi Corporation
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Part Details for MS2209
MS2209 CAD Models
MS2209 Part Data Attributes
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MS2209
Microsemi Corporation
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Datasheet
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MS2209
Microsemi Corporation
RF Power Bipolar Transistor, 1-Element, L Band, Silicon, NPN, 0.400 X 0.400 INCH, HERMETIC SEALED, 2NFL, S042, 4 PIN
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | 0.400 X 0.400 INCH, HERMETIC SEALED, 2NFL, S042, 4 PIN | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Case Connection | BASE | |
| Collector Current-Max (IC) | 7 A | |
| Configuration | SINGLE | |
| Highest Frequency Band | L BAND | |
| JESD-30 Code | S-CDFM-F2 | |
| JESD-609 Code | e0 | |
| Number of Elements | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 200 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Shape | SQUARE | |
| Package Style | FLANGE MOUNT | |
| Polarity/Channel Type | NPN | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | FLAT | |
| Terminal Position | DUAL | |
| Transistor Application | AMPLIFIER | |
| Transistor Element Material | SILICON |
Alternate Parts for MS2209
This table gives cross-reference parts and alternative options found for MS2209. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MS2209, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MRF10031 | TRANSISTOR,BJT,NPN,3A I(C),FO-57C | TE Connectivity | MS2209 vs MRF10031 |
| AM80912-030 | L BAND, Si, NPN, RF POWER TRANSISTOR, 0.400 X 0.400 INCH, HERMETIC SEALED, METAL CERAMIC, S036, 2 PIN | STMicroelectronics | MS2209 vs AM80912-030 |
| AM80912-005 | L BAND, Si, NPN, RF POWER TRANSISTOR, 0.310 X 0.310 INCH, HERMETIC SEALED, METAL CERAMIC, S064, IMPAC-2 | STMicroelectronics | MS2209 vs AM80912-005 |
| MZ0912B50Y | RF Power Bipolar Transistor, 1-Element, L Band, Silicon, NPN, 0.400 INCH, FM-2 | Advanced Semiconductor Inc | MS2209 vs MZ0912B50Y |
| MS2213 | RF Power Bipolar Transistor, 1-Element, L Band, Silicon, NPN, 0.400 X 0.400 INCH, HERMETIC SEALED, M214, 2 PIN | Microsemi Corporation | MS2209 vs MS2213 |
| AJT006 | RF Power Bipolar Transistor, 1-Element, L Band, Silicon, NPN, 0.310 INCH, FM-2 | Advanced Semiconductor Inc | MS2209 vs AJT006 |
| MRF10005 | TRANSISTOR,BJT,NPN,1.25MA I(C),RFMOD | TE Connectivity | MS2209 vs MRF10005 |
| MRF10031 | L BAND, Si, NPN, RF POWER TRANSISTOR, HERMETIC SEALED, CASE 376B-02, 2 PIN | Motorola Mobility LLC | MS2209 vs MRF10031 |
| MZ0912B50Y,114 | MZ0912B50Y | NXP Semiconductors | MS2209 vs MZ0912B50Y,114 |