Memory
MSM832S-10
Description: Standard SRAM, 32KX8, 100ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28

Overview of MSM832S-10 by APTA Group Inc

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Consumer Electronics Space Technology Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Entertainment and Gaming

CAD Models for MSM832S-10 by APTA Group Inc
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Part Data Attributes for MSM832S-10 by APTA Group Inc

MSM832S-10
APTA Group Inc
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
APTA GROUP INC
Part Package Code
DIP
Package Description
DIP, DIP28,.6
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
100 ns
I/O Type
COMMON
JESD-30 Code
R-CDIP-T28
Length
35.56 mm
Memory Density
262144 bit
Memory IC Type
STANDARD SRAM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
32KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
4.45 mm
Standby Current-Max
0.003 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.07 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
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  1. MSM832S-10
    APTA Group Inc
    Standard SRAM, 32KX8, 100ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28
    VS

Alternate Parts for MSM832S-10

This table gives cross-reference parts and alternative options found for MSM832S-10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MSM832S-10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
U62256ADK10LL Standard SRAM, 32KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Alliance Memory Inc MSM832S-10 vs U62256ADK10LL
TC55257BPL-10L(LT) IC 32K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM Toshiba America Electronic Components MSM832S-10 vs TC55257BPL-10L(LT)
MB84256C-10LLP 32KX8 STANDARD SRAM, 100ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 FUJITSU Limited MSM832S-10 vs MB84256C-10LLP
U62256ADC10LLG1 32KX8 STANDARD SRAM, 100ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Cypress Semiconductor MSM832S-10 vs U62256ADC10LLG1
5962-8866201XX Standard SRAM, 32KX8, 100ns, CMOS, CDIP28, Teledyne e2v MSM832S-10 vs 5962-8866201XX
SRM2B256SLCT10 32KX8 STANDARD SRAM, 100ns, PDIP28, PLASTIC, DIP2-28 Epson Electronics America Inc MSM832S-10 vs SRM2B256SLCT10
SRM2B256SLCT10 Standard SRAM, 32KX8, 100ns, CMOS, PDIP28, PLASTIC, DIP2-28 Seiko Epson Corporation MSM832S-10 vs SRM2B256SLCT10
TC55257BPL-10L IC 32K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM Toshiba America Electronic Components MSM832S-10 vs TC55257BPL-10L
MSM832SI-10 Standard SRAM, 32KX8, 100ns, CMOS, CDIP28, DIP-28 Mosaic Semiconductor Inc MSM832S-10 vs MSM832SI-10
EDI8832C100CM Standard SRAM, 32KX8, 100ns, CMOS, CDIP28, Electronic Designs Inc MSM832S-10 vs EDI8832C100CM
Part Number Description Manufacturer Compare
WS128K32-45HSME SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp MSM832S-10 vs WS128K32-45HSME
CY7C194-35LC Standard SRAM, 64KX4, 35ns, CMOS, LCC-28 Cypress Semiconductor MSM832S-10 vs CY7C194-35LC
SMDP-65656L45 Standard SRAM, 32KX8, CMOS, CDFP28, Temic Semiconductors MSM832S-10 vs SMDP-65656L45
FT6264-45PCLF Standard SRAM, 8KX8, 45ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Force Technologies Ltd MSM832S-10 vs FT6264-45PCLF
FT6198A-20DC Standard SRAM, 16KX4, 20ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Force Technologies Ltd MSM832S-10 vs FT6198A-20DC
WS128K32V-20G4S SRAM Module, 512KX8, 20ns, CMOS, White Electronic Designs Corp MSM832S-10 vs WS128K32V-20G4S
WS128K32-20G4I SRAM Module, 512KX8, 20ns, CMOS, CQFP68, 40 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp MSM832S-10 vs WS128K32-20G4I
MB8287-35PSK Standard SRAM, 32KX8, 35ns, CMOS, PDIP32, 0.300 INCH, SKINNY, PLASTIC, DIP-32 FUJITSU Semiconductor Limited MSM832S-10 vs MB8287-35PSK
WS128K32-45G2IA SRAM Module, 512KX8, 45ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp MSM832S-10 vs WS128K32-45G2IA
IMS1820W-35 64KX4 STANDARD SRAM, 35ns, CQCC28, CERAMIC, LCC-28 STMicroelectronics MSM832S-10 vs IMS1820W-35

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