-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
DDR DRAM,
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
ADM3062EACPZ | Analog Devices | 1/2 Duplex 500kbps RS-485/422 | |
LT3062EMS8E#TRPBF | Analog Devices | 45V Vin, uP, L N, 200mA LDO | |
LT3062EMS8E-3.3#PBF | Analog Devices | 45V Vin, uP, L N, 200mA LDO |
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
80AH7945
|
Newark | Dram, 1G X 16Bit, 0 To 95Deg C, Dram Type:Ddr4, Memory Configuration:1G X 16Bit, Clock Frequency Max:1.6Ghz, Ic Case/Package:Tfbga, No. Of Pins:96Pins, Supply Voltage Nom:1.2V, Ic Mounting:Surface Mount, Product Range:- Rohs Compliant: Yes |Micron MT40A1G16KNR-062E:E RoHS: Compliant Min Qty: 1080 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
MT40A1G16KNR-062E:E
Micron Technology Inc
Buy Now
Datasheet
|
Compare Parts:
MT40A1G16KNR-062E:E
Micron Technology Inc
DDR DRAM,
|
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Package Description | TFBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Samacsys Manufacturer | Micron | |
Access Mode | SINGLE BANK PAGE BURST | |
Additional Feature | AUTO REFRESH | |
JESD-30 Code | R-PBGA-B96 | |
JESD-609 Code | e1 | |
Length | 13.5 mm | |
Memory Density | 17179869184 bit | |
Memory IC Type | DDR4 DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 96 | |
Number of Words | 1073741824 words | |
Number of Words Code | 1000000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | ||
Organization | 1GX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA96,9X16,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Refresh Cycles | 8192 | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 1.26 V | |
Supply Voltage-Min (Vsup) | 1.14 V | |
Supply Voltage-Nom (Vsup) | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 7.5 mm |