Part Details for MT40A2G4SA-075:E by Micron Technology Inc
Overview of MT40A2G4SA-075:E by Micron Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Price & Stock for MT40A2G4SA-075:E
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
80AH7964
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Newark | Dram, 2G X 4Bit, 0 To 95Deg C, Dram Type:Ddr4, Memory Configuration:2G X 4Bit, Clock Frequency Max:1.333Ghz, Ic Case/Package:Fbga, No. Of Pins:78Pins, Supply Voltage Nom:1.2V, Ic Mounting:Surface Mount, Product Range:- Rohs Compliant: Yes |Micron MT40A2G4SA-075:E RoHS: Compliant Min Qty: 1260 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Part Details for MT40A2G4SA-075:E
MT40A2G4SA-075:E CAD Models
MT40A2G4SA-075:E Part Data Attributes
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MT40A2G4SA-075:E
Micron Technology Inc
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Datasheet
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MT40A2G4SA-075:E
Micron Technology Inc
DDR DRAM, 2GX4, CMOS, PBGA78, FBGA-78
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Package Description | TFBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Date Of Intro | 2017-07-13 | |
Samacsys Manufacturer | Micron | |
Access Mode | MULTI BANK PAGE BURST | |
Clock Frequency-Max (fCLK) | 1333 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 8 | |
JESD-30 Code | R-PBGA-B78 | |
JESD-609 Code | e1 | |
Length | 11 mm | |
Memory Density | 8589934592 bit | |
Memory IC Type | DDR4 DRAM | |
Memory Width | 4 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 78 | |
Number of Words | 2147483648 words | |
Number of Words Code | 2000000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | ||
Organization | 2GX4 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA78,9X13,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Refresh Cycles | 8192 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Sequential Burst Length | 8 | |
Supply Voltage-Max (Vsup) | 1.26 V | |
Supply Voltage-Min (Vsup) | 1.14 V | |
Supply Voltage-Nom (Vsup) | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 7.5 mm |
Alternate Parts for MT40A2G4SA-075:E
This table gives cross-reference parts and alternative options found for MT40A2G4SA-075:E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MT40A2G4SA-075:E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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MT40A2G4WE-075E:B | DDR DRAM, 2GX4, CMOS, PBGA78, FBGA-78 | Micron Technology Inc | MT40A2G4SA-075:E vs MT40A2G4WE-075E:B |