Datasheets
MX23C3210MC-10G by: Macronix International Co Ltd

MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.500 INCH, LEAD FREE, MO-175, SOP-44

Part Details for MX23C3210MC-10G by Macronix International Co Ltd

Overview of MX23C3210MC-10G by Macronix International Co Ltd

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Available Datasheets

Part # Manufacturer Description Datasheet
RJMG301T244E3ER Amphenol Communications Solutions RJMG 1x1 10G RightAngle
XGXP-1396-10D Amphenol Communications Solutions 10G SFP+ 1310nm LR
XPBL-495596-80D Amphenol Communications Solutions 10G BIDI SFP+ ZR

Part Details for MX23C3210MC-10G

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MX23C3210MC-10G Part Data Attributes

MX23C3210MC-10G Macronix International Co Ltd
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MX23C3210MC-10G Macronix International Co Ltd MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.500 INCH, LEAD FREE, MO-175, SOP-44
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MACRONIX INTERNATIONAL CO LTD
Part Package Code SOIC
Package Description SOP, SOP44,.63
Pin Count 44
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 100 ns
Additional Feature CAN ALSO BE CONFIGURED AS 2M X 16
Alternate Memory Width 8
JESD-30 Code R-PDSO-G44
JESD-609 Code e3
Length 28.5 mm
Memory Density 33554432 bit
Memory IC Type MASK ROM
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 44
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX16
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP44,.63
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 3 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 12.6 mm

Alternate Parts for MX23C3210MC-10G

This table gives cross-reference parts and alternative options found for MX23C3210MC-10G. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MX23C3210MC-10G, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
KM23C32000CG-10 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor MX23C3210MC-10G vs KM23C32000CG-10
KM23C32005BG-10 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor MX23C3210MC-10G vs KM23C32005BG-10
MR533252J-XXMA MASK ROM, 2MX16, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44 LAPIS Semiconductor Co Ltd MX23C3210MC-10G vs MR533252J-XXMA
K3P6C1000F-GC100 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor MX23C3210MC-10G vs K3P6C1000F-GC100
K3N6C1000F-GC10 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor MX23C3210MC-10G vs K3N6C1000F-GC10
K3N6C1000E-GC100 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor MX23C3210MC-10G vs K3N6C1000E-GC100
MSM533222E-XXGS-K MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, PLASTIC, SOP-44 OKI Electric Industry Co Ltd MX23C3210MC-10G vs MSM533222E-XXGS-K
K3P6C1000B-GC10 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor MX23C3210MC-10G vs K3P6C1000B-GC10
K3N6C1000C-GC10 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor MX23C3210MC-10G vs K3N6C1000C-GC10
MX23C3211MC-10 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.500 INCH, MO-175, SOP-44 Macronix International Co Ltd MX23C3210MC-10G vs MX23C3211MC-10
Part Number Description Manufacturer Compare
KM23C32005BG-12 MASK ROM, 2MX16, 120ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor MX23C3210MC-10G vs KM23C32005BG-12
KM23V32005BG-12 MASK ROM, 2MX16, 120ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor MX23C3210MC-10G vs KM23V32005BG-12
K3N6C1500C-TE15 MASK ROM, 4MX8, 150ns, CMOS, PDSO44, TSOP2-44 Samsung Semiconductor MX23C3210MC-10G vs K3N6C1500C-TE15
MR533252J-XXMA MASK ROM, 2MX16, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44 LAPIS Semiconductor Co Ltd MX23C3210MC-10G vs MR533252J-XXMA
UPD23C32000LG5-XXX-7JF MASK ROM, 4MX8, 140ns, MOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44 NEC Electronics Group MX23C3210MC-10G vs UPD23C32000LG5-XXX-7JF
LH5332500N-15 MASK ROM, 4MX8, 150ns, CMOS, PDSO44, 0.600 INCH, PLASTIC, SOP-44 Sharp Corp MX23C3210MC-10G vs LH5332500N-15
K3N6V1000E-TC10 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 Samsung Semiconductor MX23C3210MC-10G vs K3N6V1000E-TC10
AM29F032B150SI 4MX8 FLASH 5V PROM, 150ns, PDSO44, SOP-44 AMD MX23C3210MC-10G vs AM29F032B150SI
MX29LV320MTMC-70R Flash, 2MX16, 70ns, PDSO44, 0.500 INCH, MO-175, SOP-44 Macronix International Co Ltd MX23C3210MC-10G vs MX29LV320MTMC-70R
K3N6V1000F-GC100 MASK ROM, 2MX16, 100ns, CMOS, PDSO44, 0.600 INCH, SOP-44 Samsung Semiconductor MX23C3210MC-10G vs K3N6V1000F-GC100

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