Datasheets
MYX4DD3512M72PBG2-XT by: Micross Components

DRAM,

Part Details for MYX4DD3512M72PBG2-XT by Micross Components

Overview of MYX4DD3512M72PBG2-XT by Micross Components

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Part Details for MYX4DD3512M72PBG2-XT

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MYX4DD3512M72PBG2-XT Part Data Attributes

MYX4DD3512M72PBG2-XT Micross Components
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MYX4DD3512M72PBG2-XT Micross Components DRAM,
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer MICROSS COMPONENTS
Package Description ,
Reach Compliance Code compliant
ECCN Code EAR99
Access Mode MULTI BANK PAGE BURST
Access Time-Max 125 ns
Additional Feature SEATED HGT-CALCULATED
Clock Frequency-Max (fCLK) 667 MHz
I/O Type COMMON
Interleaved Burst Length 8
JESD-30 Code R-PBGA-B375
Length 21.625 mm
Memory Density 38654705664 bit
Memory IC Type DDR3 DRAM
Memory Width 72
Number of Functions 1
Number of Ports 1
Number of Terminals 375
Number of Words 536870912 words
Number of Words Code 512
Operating Mode SYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 512MX72
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA375,18X21,40
Package Shape RECTANGULAR
Package Style GRID ARRAY
Seated Height-Max 2.96 mm
Self Refresh YES
Sequential Burst Length 8
Standby Current-Max 0.000075 A
Supply Current-Max 1.15 mA
Supply Voltage-Max (Vsup) 1.45 V
Supply Voltage-Min (Vsup) 1.283 V
Supply Voltage-Nom (Vsup) 1.35 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 19.125 mm

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