Part Details for NAND08GR4B2CZC1 by STMicroelectronics
Overview of NAND08GR4B2CZC1 by STMicroelectronics
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for NAND08GR4B2CZC1
NAND08GR4B2CZC1 CAD Models
NAND08GR4B2CZC1 Part Data Attributes:
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NAND08GR4B2CZC1
STMicroelectronics
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Datasheet
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NAND08GR4B2CZC1
STMicroelectronics
512MX16 FLASH 1.8V PROM, 35ns, PBGA63, 9.50 X 12 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LFBGA-63
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | BGA | |
| Package Description | LFBGA, | |
| Pin Count | 63 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 35 ns | |
| JESD-30 Code | R-PBGA-B63 | |
| JESD-609 Code | e0 | |
| Length | 15 mm | |
| Memory Density | 8589934592 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 63 | |
| Number of Words | 536870912 words | |
| Number of Words Code | 512000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 1.8 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 8.5 mm |