Datasheets
NM27C010QM150 by:

IC 128K X 8 UVPROM, 150 ns, CDIP32, WINDOWED, CERAMIC, DIP-32, Programmable ROM

Part Details for NM27C010QM150 by National Semiconductor Corporation

Overview of NM27C010QM150 by National Semiconductor Corporation

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Applications Computing and Data Storage Financial Technology (Fintech) Telecommunications

Part Details for NM27C010QM150

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NM27C010QM150 Part Data Attributes

NM27C010QM150 National Semiconductor Corporation
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NM27C010QM150 National Semiconductor Corporation IC 128K X 8 UVPROM, 150 ns, CDIP32, WINDOWED, CERAMIC, DIP-32, Programmable ROM
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Package Description WDIP, DIP32,.6
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 150 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T32
JESD-609 Code e0
Memory Density 1048576 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.969 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for NM27C010QM150

This table gives cross-reference parts and alternative options found for NM27C010QM150. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NM27C010QM150, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8961405XX UVPROM, 128KX8, 150ns, CMOS, CDIP32 Teledyne e2v NM27C010QM150 vs 5962-8961405XX
M5M27C100K-15 UVPROM, 128KX8, 150ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-32 Mitsubishi Electric NM27C010QM150 vs M5M27C100K-15
M27C1000-15F6 128KX8 UVPROM, 150ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32 STMicroelectronics NM27C010QM150 vs M27C1000-15F6
HN27C301AG-15 128KX8 UVPROM, 150ns, CDIP32, 0.600 INCH, CERDIP-32 Renesas Electronics Corporation NM27C010QM150 vs HN27C301AG-15
NM27C010Q150 128KX8 UVPROM, 150ns, CDIP32, WINDOWED, CERAMIC, DIP-32 Texas Instruments NM27C010QM150 vs NM27C010Q150
5962-8961405QXX IC 128K X 8 UVPROM, 150 ns, CDIP32, 0.600 INCH, CERAMIC, DIP-32, Programmable ROM Texas Instruments NM27C010QM150 vs 5962-8961405QXX
5962-8961410MXX UVPROM, 128KX8, 150ns, CMOS, CDIP32 Teledyne e2v NM27C010QM150 vs 5962-8961410MXX
MBM27C1000-15Z Memory IC FUJITSU Limited NM27C010QM150 vs MBM27C1000-15Z
M27C1001-15XF1 128KX8 UVPROM, 150ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics NM27C010QM150 vs M27C1001-15XF1
FM27C010Q150 UVPROM, 128KX8, 150ns, CMOS, CDIP32, WINDOWED, CERDIP-32 Rochester Electronics LLC NM27C010QM150 vs FM27C010Q150
Part Number Description Manufacturer Compare
AM27C010-155DC UVPROM, 128KX8, 150ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD NM27C010QM150 vs AM27C010-155DC
M27C1001-15XF6 128KX8 UVPROM, 150ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics NM27C010QM150 vs M27C1001-15XF6
TMS27C010A-15JL 1 048 576-Bit Programmable Read-Only Memory 32-CDIP 0 to 70 Texas Instruments NM27C010QM150 vs TMS27C010A-15JL
M27C1001-15F6L 128KX8 UVPROM, 150ns, CDIP32, WINDOWED, FRIT SEALED, CERAMIC, DIP-32 STMicroelectronics NM27C010QM150 vs M27C1001-15F6L
FM27C010Q150 UVPROM, 128KX8, 150ns, CMOS, CDIP32, WINDOWED, CERDIP-32 Rochester Electronics LLC NM27C010QM150 vs FM27C010Q150
IS27C010-15CWI UVPROM, 128KX8, 150ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Integrated Silicon Solution Inc NM27C010QM150 vs IS27C010-15CWI
M27C1001-15XF1 128KX8 UVPROM, 150ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics NM27C010QM150 vs M27C1001-15XF1
5962-8961405XA UVPROM, 128KX8, 150ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Waferscale Integration Inc NM27C010QM150 vs 5962-8961405XA
M5M27C101K-15 UVPROM, 128KX8, 150ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-32 Mitsubishi Electric NM27C010QM150 vs M5M27C101K-15
TC571001D-15 IC 128K X 8 UVPROM, 150 ns, CDIP32, CERDIP-32, Programmable ROM Toshiba America Electronic Components NM27C010QM150 vs TC571001D-15

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