Part Details for S25FL064P0XBHV020 by Spansion
Overview of S25FL064P0XBHV020 by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for S25FL064P0XBHV020
S25FL064P0XBHV020 CAD Models
S25FL064P0XBHV020 Part Data Attributes:
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S25FL064P0XBHV020
Spansion
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Datasheet
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S25FL064P0XBHV020
Spansion
Flash, 64MX1, PBGA24, 6 X 8 MM, 1 MM PITCH, HOLOGEN FREE, BGA-24
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | BGA | |
| Package Description | VBGA, BGA24,5X5,40 | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 104 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Serial Bus Type | QSPI | |
| Standby Current-Max | 0.00001 A | |
| Supply Current-Max | 0.038 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.2 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for S25FL064P0XBHV020
This table gives cross-reference parts and alternative options found for S25FL064P0XBHV020. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S25FL064P0XBHV020, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| S25FL064P0XBHI023 | Flash, 64MX1, PBGA24, BGA-24 | Cypress Semiconductor | S25FL064P0XBHV020 vs S25FL064P0XBHI023 |
| S25FL064P0XBHV023 | Flash, 64MX1, PBGA24, BGA-24 | Cypress Semiconductor | S25FL064P0XBHV020 vs S25FL064P0XBHV023 |
| S25FL064P0XBHI020 | Flash, 64MX1, PBGA24, BGA-24 | Cypress Semiconductor | S25FL064P0XBHV020 vs S25FL064P0XBHI020 |
| S25FL064P0XBHV023 | Flash, 64MX1, PBGA24, 6 X 8 MM, 1 MM PITCH, HOLOGEN FREE, BGA-24 | Spansion | S25FL064P0XBHV020 vs S25FL064P0XBHV023 |
| S25FL064P0XBHI020 | Flash, 64MX1, PBGA24, 6 X 8 MM, 1 MM PITCH, HOLOGEN FREE, BGA-24 | Spansion | S25FL064P0XBHV020 vs S25FL064P0XBHI020 |