There are no models available for this part yet.
Overview of S25FL128SAGBHI200 by Spansion
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Computing and Data Storage
Healthcare
Price & Stock for S25FL128SAGBHI200 by Spansion
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
| Bristol Electronics | 32 |
|
RFQ | ||||
| Quest Components | 128MX1 FLASH 3V PROM | 25 |
|
$3.4800 / $5.2200 | Buy Now |
CAD Models for S25FL128SAGBHI200 by Spansion
Part Data Attributes for S25FL128SAGBHI200 by Spansion
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
SPANSION INC
|
|
Part Package Code
|
BGA
|
|
Package Description
|
FBGA-24
|
|
Pin Count
|
24
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.B.1.A
|
|
HTS Code
|
8542.32.00.51
|
|
Samacsys Manufacturer
|
Spansion
|
|
Additional Feature
|
ALSO CONFIGURABLE AS 128M X 1
|
|
Alternate Memory Width
|
2
|
|
Clock Frequency-Max (fCLK)
|
133 MHz
|
|
Data Retention Time-Min
|
20
|
|
Endurance
|
100000 Write/Erase Cycles
|
|
JESD-30 Code
|
R-PBGA-B24
|
|
Length
|
8 mm
|
|
Memory Density
|
134217728 bit
|
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Memory IC Type
|
FLASH
|
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Memory Width
|
8
|
|
Number of Functions
|
1
|
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Number of Terminals
|
24
|
|
Number of Words
|
16777216 words
|
|
Number of Words Code
|
16000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
16MX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TBGA
|
|
Package Equivalence Code
|
BGA24,5X5,40
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, THIN PROFILE
|
|
Parallel/Serial
|
SERIAL
|
|
Programming Voltage
|
3 V
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.2 mm
|
|
Serial Bus Type
|
SPI
|
|
Standby Current-Max
|
0.0001 A
|
|
Supply Current-Max
|
0.1 mA
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
|
Supply Voltage-Nom (Vsup)
|
3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Type
|
NOR TYPE
|
|
Width
|
6 mm
|
|
Write Cycle Time-Max (tWC)
|
500 ms
|
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Write Protection
|
HARDWARE/SOFTWARE
|
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