Part Details for S25FS256SAGBHI200 by Cypress Semiconductor
Overview of S25FS256SAGBHI200 by Cypress Semiconductor
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for S25FS256SAGBHI200
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
29X1011
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Newark | Nor/Tray |Cypress Infineon Technologies S25FS256SAGBHI200 RoHS: Not Compliant Min Qty: 676 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
Buy Now | |
DISTI #
2832-S25FS256SAGBHI200-ND
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DigiKey | 1.8 V, SERIAL PERIPHERAL INTERFA Min Qty: 150 Lead time: 1 Weeks Container: Tray MARKETPLACE PRODUCT |
1110 In Stock |
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$3.7600 | Buy Now |
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Rochester Electronics | S25FS256S - 256-Mbit MIRRORBIT Flash Memory RoHS: Compliant Status: Active Min Qty: 1 | 665 |
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$3.2500 / $3.8200 | Buy Now |
|
Flip Electronics | Stock, ship today | 1217 |
|
RFQ |
Part Details for S25FS256SAGBHI200
S25FS256SAGBHI200 CAD Models
S25FS256SAGBHI200 Part Data Attributes
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S25FS256SAGBHI200
Cypress Semiconductor
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Datasheet
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S25FS256SAGBHI200
Cypress Semiconductor
Memory Controller, BGA-24
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.1.A | |
HTS Code | 8542.32.00.51 | |
Clock Frequency-Max (fCLK) | 133 MHz | |
Data Retention Time-Min | 20 | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PBGA-B24 | |
Length | 8 mm | |
Memory Density | 268435456 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 33554432 words | |
Number of Words Code | 32000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 1.8 V | |
Seated Height-Max | 1.2 mm | |
Serial Bus Type | QSPI | |
Supply Current-Max | 0.1 mA | |
Supply Voltage-Max (Vsup) | 2 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Type | NOR TYPE | |
Width | 6 mm | |
Write Protection | HARDWARE/SOFTWARE |