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Overview of S29JL064H55BFI002 by Spansion
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 9 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for S29JL064H55BFI002 by Spansion
Part Data Attributes for S29JL064H55BFI002 by Spansion
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
SPANSION INC
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|
Part Package Code
|
BGA
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|
Package Description
|
12 X 11 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-63
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Pin Count
|
63
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Reach Compliance Code
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unknown
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ECCN Code
|
EAR99
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HTS Code
|
8542.32.00.51
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|
Access Time-Max
|
55 ns
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|
Alternate Memory Width
|
8
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Boot Block
|
BOTTOM/TOP
|
|
Command User Interface
|
YES
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Common Flash Interface
|
YES
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Data Polling
|
YES
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JESD-30 Code
|
R-PBGA-B63
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|
JESD-609 Code
|
e1
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Length
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12 mm
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Memory Density
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67108864 bit
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Memory IC Type
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FLASH
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Memory Width
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16
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Moisture Sensitivity Level
|
3
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Number of Functions
|
1
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Number of Sectors/Size
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16,126
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Number of Terminals
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63
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Number of Words
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4194304 words
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Number of Words Code
|
4000000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
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Organization
|
4MX16
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Package Body Material
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PLASTIC/EPOXY
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Package Code
|
TFBGA
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Package Equivalence Code
|
BGA63,8X12,32
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Package Shape
|
RECTANGULAR
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Package Style
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GRID ARRAY, THIN PROFILE, FINE PITCH
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Parallel/Serial
|
PARALLEL
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Peak Reflow Temperature (Cel)
|
260
|
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Programming Voltage
|
3 V
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Qualification Status
|
Not Qualified
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Ready/Busy
|
YES
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Seated Height-Max
|
1.2 mm
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Sector Size
|
8K,64K
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Standby Current-Max
|
0.000005 A
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|
Supply Current-Max
|
0.045 mA
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Supply Voltage-Max (Vsup)
|
3.6 V
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Supply Voltage-Min (Vsup)
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2.7 V
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Supply Voltage-Nom (Vsup)
|
3 V
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Surface Mount
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YES
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Technology
|
CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Finish
|
TIN SILVER COPPER
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Terminal Form
|
BALL
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Terminal Pitch
|
0.8 mm
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Terminal Position
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BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
40
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Toggle Bit
|
YES
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Type
|
NOR TYPE
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Width
|
11 mm
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Alternate Parts for S29JL064H55BFI002
This table gives cross-reference parts and alternative options found for S29JL064H55BFI002. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S29JL064H55BFI002, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| S29JL064H55BFI003 | Flash, 4MX16, 55ns, PBGA63, 12 X 11 MM, LEAD FREE, FPBGA-63 | Spansion | S29JL064H55BFI002 vs S29JL064H55BFI003 |
| S29JL064H55BAI003 | Flash, 4MX16, 55ns, PBGA63, 12 X 11 MM, FPBGA-63 | Spansion | S29JL064H55BFI002 vs S29JL064H55BAI003 |
| AM29LV640GU53RWHI | Flash, 4MX16, 55ns, PBGA63, 11 X 12 MM, 0.80 MM PITCH, FBGA-63 | Spansion | S29JL064H55BFI002 vs AM29LV640GU53RWHI |
| S29JL064H55BAI000 | Flash, 4MX16, 55ns, PBGA63, 12 X 11 MM, FPBGA-63 | Spansion | S29JL064H55BFI002 vs S29JL064H55BAI000 |
| AM29LV640GU53RWHF | Flash, 4MX16, 55ns, PBGA63, 11 X 12 MM, 0.80 MM PITCH, FBGA-63 | Spansion | S29JL064H55BFI002 vs AM29LV640GU53RWHF |
| AM29DL640H55WHF | Flash, 4MX16, 55ns, PBGA63, 12 X 11 MM, 0.80 MM PITCH, FBGA-63 | Spansion | S29JL064H55BFI002 vs AM29DL640H55WHF |
| S29JL064H55BAI002 | Flash, 4MX16, 55ns, PBGA63, 12 X 11 MM, 0.80 MM PITCH, FPBGA-63 | Spansion | S29JL064H55BFI002 vs S29JL064H55BAI002 |
| AM29LV640GU53RWHI | Flash, 4MX16, 55ns, PBGA63, 11 X 12 MM, 0.80 MM PITCH, FBGA-63 | AMD | S29JL064H55BFI002 vs AM29LV640GU53RWHI |
| S29JL064H55BFI000 | Flash, 4MX16, 55ns, PBGA63, 12 X 11 MM, LEAD FREE, FPBGA-63 | Spansion | S29JL064H55BFI002 vs S29JL064H55BFI000 |