Part Details for S524C20D11-DIB0 by Samsung Semiconductor
Overview of S524C20D11-DIB0 by Samsung Semiconductor
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- Part Data Attributes: (Available)
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Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
R1EV5801MBTDRDI#B0 | Renesas Electronics Corporation | 1M EEPROM (128-Kword × 8-bit)Ready/ Busy and RES function | |
R1EV5801MBSDRDI#B0 | Renesas Electronics Corporation | 1M EEPROM (128-Kword × 8-bit)Ready/ Busy and RES function |
Part Details for S524C20D11-DIB0
S524C20D11-DIB0 CAD Models
S524C20D11-DIB0 Part Data Attributes
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S524C20D11-DIB0
Samsung Semiconductor
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S524C20D11-DIB0
Samsung Semiconductor
EEPROM, 128X8, Serial, CMOS, PDIP8
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Package Description | DIP, DIP8,.3 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Data Retention Time-Min | 100 | |
Endurance | 1000000 Write/Erase Cycles | |
I2C Control Byte | 1010DDDR | |
JESD-30 Code | R-PDIP-T8 | |
Memory Density | 1024 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Terminals | 8 | |
Number of Words | 128 words | |
Number of Words Code | 128 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128X8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP8,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | SERIAL | |
Qualification Status | Not Qualified | |
Serial Bus Type | I2C | |
Standby Current-Max | 0.000005 A | |
Supply Current-Max | 0.003 mA | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Write Protection | HARDWARE |