Datasheets
SCX18T512160AF-25E by: Xi'an UniIC Semiconductors Co Ltd

DDR DRAM,

Part Details for SCX18T512160AF-25E by Xi'an UniIC Semiconductors Co Ltd

Overview of SCX18T512160AF-25E by Xi'an UniIC Semiconductors Co Ltd

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Available Datasheets

Part # Manufacturer Description Datasheet
SIT8924BA-31-25E-1.000000 SiTime SIT8924BA-31-25E-1.000000
SIT8004AC-23-25E-150.00000 SiTime SIT8004AC-23-25E-150.00000
SiT8256AC-83-25E-156.250000 SiTime SiT8256AC-83-25E-156.250000

Part Details for SCX18T512160AF-25E

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SCX18T512160AF-25E Part Data Attributes

SCX18T512160AF-25E Xi'an UniIC Semiconductors Co Ltd
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SCX18T512160AF-25E Xi'an UniIC Semiconductors Co Ltd DDR DRAM,
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer XIAN UNILC SEMICONDUCTORS CO LTD
Package Description TFBGA,
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.28
Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.4 ns
Additional Feature AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B84
Length 12.5 mm
Memory Density 536870912 bit
Memory IC Type DDR DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 84
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 95 °C
Operating Temperature-Min
Organization 32MX16
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Seated Height-Max 1.2 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 8 mm

Alternate Parts for SCX18T512160AF-25E

This table gives cross-reference parts and alternative options found for SCX18T512160AF-25E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SCX18T512160AF-25E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MT47H32M16HR-25E:H DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, ROHS COMPLIANT, FBGA-84 Micron Technology Inc SCX18T512160AF-25E vs MT47H32M16HR-25E:H
K4T51163QQ-BIF70 DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, FBGA-84 Samsung Semiconductor SCX18T512160AF-25E vs K4T51163QQ-BIF70
IS43DR16320E-25DBL DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, BGA-84 Integrated Silicon Solution Inc SCX18T512160AF-25E vs IS43DR16320E-25DBL
NT5TU32M16EG-ACH DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, 0.80 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, VFBGA-84 Nanya Technology Corporation SCX18T512160AF-25E vs NT5TU32M16EG-ACH
K4T51163QQ-BIE70 DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, FBGA-84 Samsung Semiconductor SCX18T512160AF-25E vs K4T51163QQ-BIE70
IS43DR16320E-25DBLI-TR DDR DRAM, Integrated Silicon Solution Inc SCX18T512160AF-25E vs IS43DR16320E-25DBLI-TR
IS46DR16320E-25DBLA2-TR DDR DRAM, Integrated Silicon Solution Inc SCX18T512160AF-25E vs IS46DR16320E-25DBLA2-TR
IS46DR16320E-25DBLA1-TR DDR DRAM, Integrated Silicon Solution Inc SCX18T512160AF-25E vs IS46DR16320E-25DBLA1-TR
K4T51163QQ-BPE70 DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, FBGA-84 Samsung Semiconductor SCX18T512160AF-25E vs K4T51163QQ-BPE70
EM68B16CWPA-25H DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 10 X 12.50 MM, 1.20 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84 Etron Technology Inc SCX18T512160AF-25E vs EM68B16CWPA-25H

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