Datasheets
SRM2B256SLCX10 by:

Standard SRAM, 32KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP2-28

Part Details for SRM2B256SLCX10 by Seiko Epson Corporation

Overview of SRM2B256SLCX10 by Seiko Epson Corporation

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Part Details for SRM2B256SLCX10

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SRM2B256SLCX10 Part Data Attributes

SRM2B256SLCX10 Seiko Epson Corporation
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SRM2B256SLCX10 Seiko Epson Corporation Standard SRAM, 32KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP2-28
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SEIKO EPSON CORP
Package Description DIP, DIP28,.6
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 100 ns
Additional Feature AT SUPPLY VOLTAGE 3V, ACCESS TIME=180NANO SECOND
I/O Type COMMON
JESD-30 Code R-PDIP-T28
JESD-609 Code e0
Length 36.7 mm
Memory Density 262144 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Organization 32KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.7 mm
Standby Current-Max 0.000025 A
Standby Voltage-Min 2 V
Supply Current-Max 0.045 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for SRM2B256SLCX10

This table gives cross-reference parts and alternative options found for SRM2B256SLCX10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SRM2B256SLCX10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
U62256ADK10LL Standard SRAM, 32KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Alliance Memory Inc SRM2B256SLCX10 vs U62256ADK10LL
TC55257BPL-10L(LT) IC 32K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM Toshiba America Electronic Components SRM2B256SLCX10 vs TC55257BPL-10L(LT)
MB84256C-10LLP 32KX8 STANDARD SRAM, 100ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 FUJITSU Limited SRM2B256SLCX10 vs MB84256C-10LLP
U62256ADC10LLG1 32KX8 STANDARD SRAM, 100ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Cypress Semiconductor SRM2B256SLCX10 vs U62256ADC10LLG1
5962-8866201XX Standard SRAM, 32KX8, 100ns, CMOS, CDIP28, Teledyne e2v SRM2B256SLCX10 vs 5962-8866201XX
SRM2B256SLCT10 32KX8 STANDARD SRAM, 100ns, PDIP28, PLASTIC, DIP2-28 Epson Electronics America Inc SRM2B256SLCX10 vs SRM2B256SLCT10
SRM2B256SLCT10 Standard SRAM, 32KX8, 100ns, CMOS, PDIP28, PLASTIC, DIP2-28 Seiko Epson Corporation SRM2B256SLCX10 vs SRM2B256SLCT10
TC55257BPL-10L IC 32K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM Toshiba America Electronic Components SRM2B256SLCX10 vs TC55257BPL-10L
MSM832SI-10 Standard SRAM, 32KX8, 100ns, CMOS, CDIP28, DIP-28 Mosaic Semiconductor Inc SRM2B256SLCX10 vs MSM832SI-10
EDI8832C100CM Standard SRAM, 32KX8, 100ns, CMOS, CDIP28, Electronic Designs Inc SRM2B256SLCX10 vs EDI8832C100CM
Part Number Description Manufacturer Compare
WS128K32-45HSME SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp SRM2B256SLCX10 vs WS128K32-45HSME
CY7C194-35LC Standard SRAM, 64KX4, 35ns, CMOS, LCC-28 Cypress Semiconductor SRM2B256SLCX10 vs CY7C194-35LC
SMDP-65656L45 Standard SRAM, 32KX8, CMOS, CDFP28, Temic Semiconductors SRM2B256SLCX10 vs SMDP-65656L45
FT6264-45PCLF Standard SRAM, 8KX8, 45ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Force Technologies Ltd SRM2B256SLCX10 vs FT6264-45PCLF
FT6198A-20DC Standard SRAM, 16KX4, 20ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Force Technologies Ltd SRM2B256SLCX10 vs FT6198A-20DC
WS128K32V-20G4S SRAM Module, 512KX8, 20ns, CMOS, White Electronic Designs Corp SRM2B256SLCX10 vs WS128K32V-20G4S
WS128K32-20G4I SRAM Module, 512KX8, 20ns, CMOS, CQFP68, 40 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp SRM2B256SLCX10 vs WS128K32-20G4I
MB8287-35PSK Standard SRAM, 32KX8, 35ns, CMOS, PDIP32, 0.300 INCH, SKINNY, PLASTIC, DIP-32 FUJITSU Semiconductor Limited SRM2B256SLCX10 vs MB8287-35PSK
WS128K32-45G2IA SRAM Module, 512KX8, 45ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp SRM2B256SLCX10 vs WS128K32-45G2IA
IMS1820W-35 64KX4 STANDARD SRAM, 35ns, CQCC28, CERAMIC, LCC-28 STMicroelectronics SRM2B256SLCX10 vs IMS1820W-35

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