Datasheets
SST39SF010A-70-4C-PHE by:

Flash, 128KX8, 70ns, PDIP32, ROHS COMPLIANT, PLASTIC, MO-015AP, DIP-32

Part Details for SST39SF010A-70-4C-PHE by Silicon Storage Technology

Overview of SST39SF010A-70-4C-PHE by Silicon Storage Technology

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Price & Stock for SST39SF010A-70-4C-PHE

Part # Distributor Description Stock Price Buy
Bristol Electronics   154
RFQ
Quest Components FLASH, 128KX8, 70NS, PDIP32 123
  • 1 $5.3775
  • 20 $3.5850
  • 71 $3.3161
$3.3161 / $5.3775 Buy Now

Part Details for SST39SF010A-70-4C-PHE

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SST39SF010A-70-4C-PHE Part Data Attributes:

SST39SF010A-70-4C-PHE Silicon Storage Technology
Buy Now Datasheet
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SST39SF010A-70-4C-PHE Silicon Storage Technology Flash, 128KX8, 70ns, PDIP32, ROHS COMPLIANT, PLASTIC, MO-015AP, DIP-32
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer SILICON STORAGE TECHNOLOGY INC
Part Package Code DIP
Package Description ROHS COMPLIANT, PLASTIC, MO-015AP, DIP-32
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 70 ns
Command User Interface YES
Data Polling YES
JESD-30 Code R-PDIP-T32
JESD-609 Code e3
Length 41.91 mm
Memory Density 1048576 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Sectors/Size 32
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX8
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 5 V
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Sector Size 4K
Standby Current-Max 0.0001 A
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Toggle Bit YES
Type NOR TYPE
Width 15.24 mm

Alternate Parts for SST39SF010A-70-4C-PHE

This table gives cross-reference parts and alternative options found for SST39SF010A-70-4C-PHE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SST39SF010A-70-4C-PHE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM29F010B-70PI Flash, 128KX8, 70ns, PDIP32, PLASTIC, DIP-32 AMD SST39SF010A-70-4C-PHE vs AM29F010B-70PI
WMF128K8-70CM5 Flash, 128KX8, 70ns, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation SST39SF010A-70-4C-PHE vs WMF128K8-70CM5
ACT-F128K8N-070P4Q Flash Module, 128KX8, 70ns, CDIP32, HERMETICALLY SEALED, CERAMIC, DIP-32 Cobham Power Products SST39SF010A-70-4C-PHE vs ACT-F128K8N-070P4Q
5962-9669004HYX Flash, 128KX8, 70ns, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation SST39SF010A-70-4C-PHE vs 5962-9669004HYX
Part Number Description Manufacturer Compare
HN27C301P-25 OTP ROM, 128KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hitachi Ltd SST39SF010A-70-4C-PHE vs HN27C301P-25
HN62331AP MASK ROM, 128KX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 Hitachi Ltd SST39SF010A-70-4C-PHE vs HN62331AP
HN27C101AG-12 UVPROM, 128KX8, 120ns, CMOS, CDIP32, 0.600 INCH, CERDIP-32 Hitachi Ltd SST39SF010A-70-4C-PHE vs HN27C101AG-12
CAT28F010V5PI-12 Flash, 128KX8, 120ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Catalyst Semiconductor SST39SF010A-70-4C-PHE vs CAT28F010V5PI-12
CAT28F010P-70 Flash, 128KX8, 70ns, PDIP32, PLASTIC, DIP-32 Catalyst Semiconductor SST39SF010A-70-4C-PHE vs CAT28F010P-70
WME128K8-120CM EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation SST39SF010A-70-4C-PHE vs WME128K8-120CM
MSM531031B-RS 128KX8 MASK PROM, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 OKI Electric Industry Co Ltd SST39SF010A-70-4C-PHE vs MSM531031B-RS
HN62331AP-12 MASK ROM, 128KX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 Hitachi Ltd SST39SF010A-70-4C-PHE vs HN62331AP-12
5962-9309103HYA EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 Microsemi Corporation SST39SF010A-70-4C-PHE vs 5962-9309103HYA
5962-9309103HYC EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 Microsemi Corporation SST39SF010A-70-4C-PHE vs 5962-9309103HYC

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