Part Details for TBP18S22N by Texas Instruments
Results Overview of TBP18S22N by Texas Instruments
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (10 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Industrial Automation
Energy and Power Systems
Renewable Energy
TBP18S22N Information
TBP18S22N by Texas Instruments is an OTP ROM.
OTP ROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for TBP18S22N
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | IC,PROM,256X8,TTL,DIP,20PIN,PLASTIC | 40 |
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$7.4750 / $11.5000 | Buy Now |
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Vyrian | OTP ROM, 256X8, 70ns, TTL, PDIP20 | 4636 |
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RFQ |
US Tariff Estimator: TBP18S22N by Texas Instruments
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for TBP18S22N
TBP18S22N Part Data Attributes
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TBP18S22N
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
TBP18S22N
Texas Instruments
OTP ROM, 1KX8, 70ns, TTL, PDIP20
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| Part Life Cycle Code | Obsolete | |
| Package Description | Dip-20 | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 70 Ns | |
| JESD-30 Code | R-PDIP-T20 | |
| Memory Density | 8192 Bit | |
| Memory IC Type | Otp Rom | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Number of Words | 256 Words | |
| Number of Words Code | 1000 | |
| Operating Mode | Asynchronous | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1kx8 | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | DIP | |
| Package Equivalence Code | DIP20,.3 | |
| Package Shape | Rectangular | |
| Package Style | In-Line | |
| Parallel/Serial | Parallel | |
| Qualification Status | Not Qualified | |
| Supply Current-Max | 0.17 Ma | |
| Surface Mount | No | |
| Technology | Ttl | |
| Temperature Grade | Commercial | |
| Terminal Form | Through-Hole | |
| Terminal Pitch | 2.54 Mm | |
| Terminal Position | Dual |
Alternate Parts for TBP18S22N
This table gives cross-reference parts and alternative options found for TBP18S22N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TBP18S22N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| SNC54S470J | Texas Instruments | Check for Price | OTP ROM, 32KX8, 120ns, TTL, CDIP20 | TBP18S22N vs SNC54S470J |
| TBP18S22N1 | Texas Instruments | Check for Price | OTP ROM, 1KX4, TTL, PDIP20 | TBP18S22N vs TBP18S22N1 |
| TBP18SA22N | Texas Instruments | Check for Price | OTP ROM, 4KX8, 45ns, TTL, PDIP20 | TBP18S22N vs TBP18SA22N |
| TBP38S22-18N | Texas Instruments | Check for Price | OTP ROM, 512X8, 60ns, TTL, PDIP20 | TBP18S22N vs TBP38S22-18N |
| DM74S470N | National Semiconductor Corporation | Check for Price | OTP ROM, 256X8, 60ns, TTL, PDIP20 | TBP18S22N vs DM74S470N |
| DM74S471J | National Semiconductor Corporation | Check for Price | OTP ROM, 256X8, 60ns, TTL, CDIP20 | TBP18S22N vs DM74S471J |
| TBP18SA22NP1 | Texas Instruments | Check for Price | OTP ROM, 4KX8, 95ns, TTL, PDIP20 | TBP18S22N vs TBP18SA22NP1 |
| TBP18S22NP3 | Texas Instruments | Check for Price | OTP ROM, 512X8, 55ns, TTL, PDIP20 | TBP18S22N vs TBP18S22NP3 |
| CBP18S22MJ | Texas Instruments | Check for Price | OTP ROM, 256X4, 60ns, TTL, CDIP20 | TBP18S22N vs CBP18S22MJ |
| CBP18SA22MJ | Texas Instruments | Check for Price | OTP ROM, 1KX4, 45ns, TTL, CDIP20 | TBP18S22N vs CBP18SA22MJ |
TBP18S22N Frequently Asked Questions (FAQ)
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Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-frequency design practices, such as using a solid ground plane, minimizing trace lengths, and using vias to connect the ground plane to the thermal pad.
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Proper thermal management is crucial for the TBP18S22N. Ensure good thermal conductivity by using a thermal interface material (TIM) between the device and the heat sink, and design the heat sink to have a low thermal resistance. Also, follow the recommended thermal pad connection and PCB layout guidelines.
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The TBP18S22N has an operating temperature range of -40°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range. It's recommended to operate the device within a temperature range of 0°C to 125°C for optimal performance.
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To minimize high-frequency noise and EMI, use proper shielding, grounding, and filtering techniques. Ensure the PCB layout is designed to minimize radiation and coupling, and use components with low equivalent series resistance (ESR) and equivalent series inductance (ESL).
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The recommended input and output capacitors for the TBP18S22N are ceramic capacitors with low ESR and ESL. A 10-22 μF input capacitor and a 10-47 μF output capacitor are typical values. However, the optimal capacitor values may vary depending on the specific application and operating conditions.