Part Details for TBP28L42MJ by Texas Instruments
Overview of TBP28L42MJ by Texas Instruments
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for TBP28L42MJ
TBP28L42MJ CAD Models
TBP28L42MJ Part Data Attributes
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TBP28L42MJ
Texas Instruments
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Datasheet
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TBP28L42MJ
Texas Instruments
512X8 OTPROM, 110ns, CDIP20, CERAMIC, DIP-20
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP20,.3 | |
| Pin Count | 20 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 15 ns | |
| JESD-30 Code | R-GDIP-T20 | |
| Length | 24.195 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Number of Words | 512 words | |
| Number of Words Code | 8000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 8KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP20,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 7.62 mm |
Alternate Parts for TBP28L42MJ
This table gives cross-reference parts and alternative options found for TBP28L42MJ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TBP28L42MJ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| R29623DM/883B | OTP ROM, 512X8, 100ns, Bipolar, CDIP20, 0.300 INCH, CERDIP-20 | Fairchild Semiconductor Corporation | TBP28L42MJ vs R29623DM/883B |
| DM74S473AN | IC 512 X 8 OTPROM, 45 ns, PDIP20, PLASTIC, DIP-20, Programmable ROM | National Semiconductor Corporation | TBP28L42MJ vs DM74S473AN |
| 63S481AN | OTP ROM, 512X8, 30ns, CMOS, PDIP20, | Monolithic Memories (RETIRED) | TBP28L42MJ vs 63S481AN |
| 5349-1J | OTP ROM, 512X8, 80ns, CMOS, CDIP20, | Monolithic Memories (RETIRED) | TBP28L42MJ vs 5349-1J |
| R29623DM | OTP ROM, 512X8, 100ns, Bipolar, CDIP20, CERDIP-20 | Fairchild Semiconductor Corporation | TBP28L42MJ vs R29623DM |
| 6348-1N | OTP ROM, 512X8, 70ns, CMOS, PDIP20, | Monolithic Memories (RETIRED) | TBP28L42MJ vs 6348-1N |
| N82S147NB | IC 512 X 8 OTPROM, 60 ns, PDIP20, Programmable ROM | NXP Semiconductors | TBP28L42MJ vs N82S147NB |
| AM27S28PC | OTP ROM, 512X8, 55ns, Bipolar, PDIP20, PLASTIC, DIP-20 | AMD | TBP28L42MJ vs AM27S28PC |
| AM27S28ADC | OTP ROM, 512X8, 35ns, Bipolar, CDIP20, HERMETIC SEALED, CERAMIC, DIP-20 | AMD | TBP28L42MJ vs AM27S28ADC |
| AM27S29APCB | OTP ROM, 512X8, 35ns, Bipolar, PDIP20, PLASTIC, DIP-20 | AMD | TBP28L42MJ vs AM27S29APCB |