Datasheets
TC55257APL-10L by: Toshiba America Electronic Components

IC 32K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM

Part Details for TC55257APL-10L by Toshiba America Electronic Components

Overview of TC55257APL-10L by Toshiba America Electronic Components

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Part Details for TC55257APL-10L

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TC55257APL-10L Part Data Attributes

TC55257APL-10L Toshiba America Electronic Components
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TC55257APL-10L Toshiba America Electronic Components IC 32K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer TOSHIBA CORP
Part Package Code DIP
Package Description DIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 100 ns
Additional Feature LOW POWER STANDBY MODE; POWER DOWN FEATURE
I/O Type COMMON
JESD-30 Code R-PDIP-T28
JESD-609 Code e0
Memory Density 262144 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.2 mm
Standby Current-Max 0.00003 A
Standby Voltage-Min 2 V
Supply Current-Max 0.07 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for TC55257APL-10L

This table gives cross-reference parts and alternative options found for TC55257APL-10L. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC55257APL-10L, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
U62256ADK10LL Standard SRAM, 32KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Alliance Memory Inc TC55257APL-10L vs U62256ADK10LL
TC55257BPL-10L(LT) IC 32K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM Toshiba America Electronic Components TC55257APL-10L vs TC55257BPL-10L(LT)
MB84256C-10LLP 32KX8 STANDARD SRAM, 100ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 FUJITSU Limited TC55257APL-10L vs MB84256C-10LLP
U62256ADC10LLG1 32KX8 STANDARD SRAM, 100ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Cypress Semiconductor TC55257APL-10L vs U62256ADC10LLG1
5962-8866201XX Standard SRAM, 32KX8, 100ns, CMOS, CDIP28, Teledyne e2v TC55257APL-10L vs 5962-8866201XX
SRM2B256SLCT10 32KX8 STANDARD SRAM, 100ns, PDIP28, PLASTIC, DIP2-28 Epson Electronics America Inc TC55257APL-10L vs SRM2B256SLCT10
SRM2B256SLCT10 Standard SRAM, 32KX8, 100ns, CMOS, PDIP28, PLASTIC, DIP2-28 Seiko Epson Corporation TC55257APL-10L vs SRM2B256SLCT10
TC55257BPL-10L IC 32K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM Toshiba America Electronic Components TC55257APL-10L vs TC55257BPL-10L
MSM832SI-10 Standard SRAM, 32KX8, 100ns, CMOS, CDIP28, DIP-28 Mosaic Semiconductor Inc TC55257APL-10L vs MSM832SI-10
EDI8832C100CM Standard SRAM, 32KX8, 100ns, CMOS, CDIP28, Electronic Designs Inc TC55257APL-10L vs EDI8832C100CM
Part Number Description Manufacturer Compare
WS128K32-45HSME SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp TC55257APL-10L vs WS128K32-45HSME
CY7C194-35LC Standard SRAM, 64KX4, 35ns, CMOS, LCC-28 Cypress Semiconductor TC55257APL-10L vs CY7C194-35LC
SMDP-65656L45 Standard SRAM, 32KX8, CMOS, CDFP28, Temic Semiconductors TC55257APL-10L vs SMDP-65656L45
FT6264-45PCLF Standard SRAM, 8KX8, 45ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Force Technologies Ltd TC55257APL-10L vs FT6264-45PCLF
FT6198A-20DC Standard SRAM, 16KX4, 20ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Force Technologies Ltd TC55257APL-10L vs FT6198A-20DC
WS128K32V-20G4S SRAM Module, 512KX8, 20ns, CMOS, White Electronic Designs Corp TC55257APL-10L vs WS128K32V-20G4S
WS128K32-20G4I SRAM Module, 512KX8, 20ns, CMOS, CQFP68, 40 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp TC55257APL-10L vs WS128K32-20G4I
MB8287-35PSK Standard SRAM, 32KX8, 35ns, CMOS, PDIP32, 0.300 INCH, SKINNY, PLASTIC, DIP-32 FUJITSU Semiconductor Limited TC55257APL-10L vs MB8287-35PSK
WS128K32-45G2IA SRAM Module, 512KX8, 45ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp TC55257APL-10L vs WS128K32-45G2IA
IMS1820W-35 64KX4 STANDARD SRAM, 35ns, CQCC28, CERAMIC, LCC-28 STMicroelectronics TC55257APL-10L vs IMS1820W-35

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