Memory
TMS27C32-10JL
Texas Instruments
Description: 4KX8 UVPROM, 100ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24

Overview of TMS27C32-10JL by Texas Instruments

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Industrial Automation

Available Datasheets

Part # Manufacturer Description Datasheet
1606-10JLC Coilcraft Inc General Purpose Inductor, 0.01255uH, 5%, 1 Element, Air-Core, SMD, 1714, CHIP, 1714, ROHS COMPLIANT
1606-10JLB Coilcraft Inc General Purpose Inductor, 0.01255uH, 5%, 1 Element, Air-Core, SMD, 1714, CHIP, 1714, ROHS COMPLIANT
1812SMS-R10JLB Coilcraft Inc General Purpose Inductor, 0.1uH, 5%, 1 Element, Air-Core, SMD, 1925, ROHS COMPLIANT

CAD Models for TMS27C32-10JL by Texas Instruments
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Part Data Attributes for TMS27C32-10JL by Texas Instruments

TMS27C32-10JL
Texas Instruments
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
Part Package Code
DIP
Package Description
WDIP, DIP24,.6
Pin Count
24
Reach Compliance Code
not_compliant
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
100 ns
I/O Type
COMMON
JESD-30 Code
R-CDIP-T24
Length
31.75 mm
Memory Density
32768 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
24
Number of Words
4096 words
Number of Words Code
4000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
4KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
WDIP
Package Equivalence Code
DIP24,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
4.907 mm
Standby Current-Max
0.00025 A
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
Want to compare parts?
  1. TMS27C32-10JL
    Texas Instruments
    4KX8 UVPROM, 100ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24
    VS

Alternate Parts for TMS27C32-10JL

This table gives cross-reference parts and alternative options found for TMS27C32-10JL. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMS27C32-10JL, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
TMS27C32-100JE 4KX8 UVPROM, 100ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments TMS27C32-10JL vs TMS27C32-100JE
TMS27C32-10JE4 4KX8 UVPROM, 100ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments TMS27C32-10JL vs TMS27C32-10JE4
TMS27C32-100JL4 4KX8 UVPROM, 100ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments TMS27C32-10JL vs TMS27C32-100JL4
AM2732B-100DC UVPROM, 4KX8, 100ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD TMS27C32-10JL vs AM2732B-100DC
AM2732B-105DI UVPROM, 4KX8, 100ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD TMS27C32-10JL vs AM2732B-105DI
AM2732B-100DI UVPROM, 4KX8, 100ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD TMS27C32-10JL vs AM2732B-100DI
Part Number Description Manufacturer Compare
AM2732B-205DC UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD TMS27C32-10JL vs AM2732B-205DC
5962-9065801JX UVPROM, 4KX8, 70ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc TMS27C32-10JL vs 5962-9065801JX
LD2732A-2 UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 Intel Corporation TMS27C32-10JL vs LD2732A-2
AM2732B-205DI UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD TMS27C32-10JL vs AM2732B-205DI
WS57C43B-70D UVPROM, 4KX8, 70ns, CMOS, CDIP24, Waferscale Integration Inc TMS27C32-10JL vs WS57C43B-70D
WS57C43C-25D 4KX8 UVPROM, 25ns, CDIP24, 0.600 INCH, CERDIP-24 STMicroelectronics TMS27C32-10JL vs WS57C43C-25D
PQ36C32-55 EEPROM, 4KX8, 55ns, Parallel, CMOS, PDIP24 LSI Corporation TMS27C32-10JL vs PQ36C32-55
5962-9065804JX UVPROM, 4KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc TMS27C32-10JL vs 5962-9065804JX
MD2732A-25 UVPROM, 4KX8, 250ns, CMOS, CDIP24, CERAMIC, DIP-24 Intel Corporation TMS27C32-10JL vs MD2732A-25
WS57C43C-45TMB 4KX8 UVPROM, 45ns, CDIP24, 0.300 INCH, CERDIP-24 STMicroelectronics TMS27C32-10JL vs WS57C43C-45TMB

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