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TMS320VC5470GHKA by: Texas Instruments

System-Level Digital Signal Processor 257-BGA MICROSTAR

Part Details for TMS320VC5470GHKA by Texas Instruments

Results Overview of TMS320VC5470GHKA by Texas Instruments

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TMS320VC5470GHKA Information

TMS320VC5470GHKA by Texas Instruments is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for TMS320VC5470GHKA

Part # Distributor Description Stock Price Buy
NexGen Digital   2983
RFQ
Vyrian Obsolete 6942
RFQ

US Tariff Estimator: TMS320VC5470GHKA by Texas Instruments

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Part Details for TMS320VC5470GHKA

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TMS320VC5470GHKA Part Data Attributes

TMS320VC5470GHKA Texas Instruments
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TMS320VC5470GHKA Texas Instruments System-Level Digital Signal Processor 257-BGA MICROSTAR
Rohs Code No
Part Life Cycle Code Obsolete
Part Package Code BGA
Package Description Lfbga, Bga257,19x19,32
Pin Count 257
Reach Compliance Code Not Compliant
ECCN Code 3A991.a.2
HTS Code 8542.31.00.35
Additional Feature Also Requires 3.3v Supply
Address Bus Width 23
Barrel Shifter No
Bit Size 16
Boundary Scan Yes
Clock Frequency-Max 50 Mhz
External Data Bus Width 32
Format Fixed Point
Internal Bus Architecture Multiple
JESD-30 Code S-PBGA-B257
JESD-609 Code e0
Length 16 Mm
Low Power Mode Yes
Moisture Sensitivity Level 3
Number of Terminals 257
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material Plastic/Epoxy
Package Code LFBGA
Package Equivalence Code BGA257,19X19,32
Package Shape Square
Package Style Grid Array, Low Profile, Fine Pitch
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified
RAM (words) 16384
Screening Level Ts 16949
Seated Height-Max 1.4 Mm
Supply Voltage-Max 1.95 V
Supply Voltage-Min 1.71 V
Supply Voltage-Nom 1.8 V
Surface Mount Yes
Technology Cmos
Temperature Grade Industrial
Terminal Finish Tin Lead
Terminal Form Ball
Terminal Pitch 0.8 Mm
Terminal Position Bottom
Time@Peak Reflow Temperature-Max (s) 20
Width 16 Mm
uPs/uCs/Peripheral ICs Type Digital Signal Processor, Mixed

Alternate Parts for TMS320VC5470GHKA

This table gives cross-reference parts and alternative options found for TMS320VC5470GHKA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMS320VC5470GHKA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
TMS320VC5470GHK Texas Instruments Check for Price System-Level Digital Signal Processor 257-BGA MICROSTAR TMS320VC5470GHKA vs TMS320VC5470GHK
TMS320VC5470ZHK Texas Instruments Check for Price 32-BIT, 50MHz, MIXED DSP, PBGA257, GREEN, PLASTIC, MICRO BGA-257 TMS320VC5470GHKA vs TMS320VC5470ZHK
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TMS320VC5470GHKA Related Parts

TMS320VC5470GHKA Frequently Asked Questions (FAQ)

  • The recommended power-up sequence is to apply VDD (1.2V to 1.4V) first, followed by VDDA (1.2V to 1.4V), and then VDDS (1.2V to 1.4V). This ensures proper device operation and prevents latch-up.

  • To optimize the clock tree, use the clock domain crossing (CDC) feature to minimize clock skew and ensure proper synchronization between clock domains. Additionally, use the clock gating feature to reduce power consumption by turning off clocks to idle modules.

  • The maximum operating frequency of the TMS320VC5470GHKA is 300 MHz. However, the actual operating frequency may be limited by the specific application, board design, and thermal considerations.

  • To implement a DDR2 memory interface, use the DDR2 controller module and follow the guidelines provided in the TMS320VC5470GHKA DDR2 Interface User's Guide (SPRUFG1). Ensure proper signal integrity, termination, and clock synchronization for reliable operation.

  • To manage thermal dissipation, use a heat sink with a thermal interface material (TIM) and ensure good airflow around the device. The recommended thermal design power (TDP) is 2.5W. Follow the thermal design guidelines provided in the TMS320VC5470GHKA datasheet and thermal design guide (SPRUFG2).

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