Datasheets
TMS427809AP-60DGC by: Texas Instruments

2MX8 EDO DRAM, 60ns, PDSO28, 0.400 INCH, PLASTIC, TSOP-28

Part Details for TMS427809AP-60DGC by Texas Instruments

Overview of TMS427809AP-60DGC by Texas Instruments

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Applications Education and Research Aerospace and Defense Agriculture Technology Robotics and Drones

Part Details for TMS427809AP-60DGC

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TMS427809AP-60DGC Part Data Attributes

TMS427809AP-60DGC Texas Instruments
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TMS427809AP-60DGC Texas Instruments 2MX8 EDO DRAM, 60ns, PDSO28, 0.400 INCH, PLASTIC, TSOP-28
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC
Part Package Code TSOP
Package Description TSOP2, TSOP28,.46
Pin Count 28
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.02
Access Mode FAST PAGE WITH EDO
Access Time-Max 60 ns
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/BATTERY BACKUP/SELF REFRESH
I/O Type COMMON
JESD-30 Code R-PDSO-G28
Length 18.41 mm
Memory Density 16777216 bit
Memory IC Type EDO DRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 28
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TSOP2
Package Equivalence Code TSOP28,.46
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Refresh Cycles 2048
Seated Height-Max 1.2 mm
Self Refresh YES
Standby Current-Max 0.00015 A
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.16 mm

Alternate Parts for TMS427809AP-60DGC

This table gives cross-reference parts and alternative options found for TMS427809AP-60DGC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMS427809AP-60DGC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GM71VS17803CT-6 EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, LG Semicon Co Ltd TMS427809AP-60DGC vs GM71VS17803CT-6
GM71VS17803CLT-6 EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, LG Semicon Co Ltd TMS427809AP-60DGC vs GM71VS17803CLT-6
KM48V2004AT-6 EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 Samsung Semiconductor TMS427809AP-60DGC vs KM48V2004AT-6
IBM0117805BT3-6R EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 X 0.725 INCH, TSOP2-28 IBM TMS427809AP-60DGC vs IBM0117805BT3-6R
IBM0117805PT360 2MX8 EDO DRAM, 60ns, PDSO28, 0.400 X 0.725 INCH, TSOP2-28 IBM TMS427809AP-60DGC vs IBM0117805PT360
HM51W17805TT-6 EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 Elpida Memory Inc TMS427809AP-60DGC vs HM51W17805TT-6
UPD42S17805LG5-A60 2MX8 EDO DRAM, 60ns, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 Renesas Electronics Corporation TMS427809AP-60DGC vs UPD42S17805LG5-A60
MSM51V17805D-60TS-K EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-28 LAPIS Semiconductor Co Ltd TMS427809AP-60DGC vs MSM51V17805D-60TS-K
MB81V17805A-60PFTN EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 FUJITSU Semiconductor Limited TMS427809AP-60DGC vs MB81V17805A-60PFTN
KM48V2104ASLT-6 EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 Samsung Semiconductor TMS427809AP-60DGC vs KM48V2104ASLT-6
Part Number Description Manufacturer Compare
KM48V2104AT-6 EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 Samsung Semiconductor TMS427809AP-60DGC vs KM48V2104AT-6
K4E160812C-FC600 EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, TSOP2-28 Samsung Semiconductor TMS427809AP-60DGC vs K4E160812C-FC600
HM51W17805LS-6 EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 Elpida Memory Inc TMS427809AP-60DGC vs HM51W17805LS-6
MSM51V17805BSL-60JS EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 OKI Electric Industry Co Ltd TMS427809AP-60DGC vs MSM51V17805BSL-60JS
HY51V16804CSLT-60 EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, TSOP2-28 SK Hynix Inc TMS427809AP-60DGC vs HY51V16804CSLT-60
M5M4V17805CJ-6S EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 Mitsubishi Electric TMS427809AP-60DGC vs M5M4V17805CJ-6S
K4E160812D-FC600 EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.300 INCH, TSOP2-28 Samsung Semiconductor TMS427809AP-60DGC vs K4E160812D-FC600
KM48V2004CK-6 EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 Samsung Semiconductor TMS427809AP-60DGC vs KM48V2004CK-6
NN51V17805ALJ-60 EDO DRAM, 2MX8, 60ns, CMOS, PDSO28 United Microelectronics Corporation TMS427809AP-60DGC vs NN51V17805ALJ-60
MSM51V17805A-60TS-K EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 OKI Electric Industry Co Ltd TMS427809AP-60DGC vs MSM51V17805A-60TS-K

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