Part Details for TS(X)PC860MHVGB/Q40C by Thales Group
Overview of TS(X)PC860MHVGB/Q40C by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for TS(X)PC860MHVGB/Q40C
TS(X)PC860MHVGB/Q40C CAD Models
TS(X)PC860MHVGB/Q40C Part Data Attributes
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TS(X)PC860MHVGB/Q40C
Thales Group
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Datasheet
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TS(X)PC860MHVGB/Q40C
Thales Group
Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
Part Package Code | BGA | |
Package Description | , | |
Pin Count | 357 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 40 MHz | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B357 | |
Low Power Mode | NO | |
Number of Terminals | 357 | |
Operating Temperature-Max | 110 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Speed | 40 MHz | |
Supply Voltage-Max | 3.465 V | |
Supply Voltage-Min | 3.135 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |
Alternate Parts for TS(X)PC860MHVGB/Q40C
This table gives cross-reference parts and alternative options found for TS(X)PC860MHVGB/Q40C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TS(X)PC860MHVGB/Q40C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TS(X)PC860MHMZPU/T50C | Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TS(X)PC860MHVGB/Q40C vs TS(X)PC860MHMZPU/T50C |
TS(X)PC860MHVZPU40C | 32-BIT, 40MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TS(X)PC860MHVGB/Q40C vs TS(X)PC860MHVZPU40C |
MPC860DECZQ50D4 | PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, HDLC, PCMCIA, -40 to 95C | Freescale Semiconductor | TS(X)PC860MHVGB/Q40C vs MPC860DECZQ50D4 |
TSPC860MHMGB/Q40A3 | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Thales Group | TS(X)PC860MHVGB/Q40C vs TSPC860MHMGB/Q40A3 |
TSPC860SRMZPU80B | RISC Microprocessor, 32-Bit, 80MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TS(X)PC860MHVGB/Q40C vs TSPC860SRMZPU80B |
MPC866PZP133 | 32-BIT, 133MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TS(X)PC860MHVGB/Q40C vs MPC866PZP133 |
MPC860TCZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | TS(X)PC860MHVGB/Q40C vs MPC860TCZQ50D4 |
TSPC860MHVZP40A3 | Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TS(X)PC860MHVGB/Q40C vs TSPC860MHVZP40A3 |
XPC860ENZP66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TS(X)PC860MHVGB/Q40C vs XPC860ENZP66D4 |
XPC860SRCZP50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TS(X)PC860MHVGB/Q40C vs XPC860SRCZP50D4 |