Datasheets
V58C2512164SDLJ4 by: ProMOS Technologies Inc

DDR DRAM, 32MX16, CMOS, PBGA60, GREEN, MO-207, FBGA-60

Part Details for V58C2512164SDLJ4 by ProMOS Technologies Inc

Overview of V58C2512164SDLJ4 by ProMOS Technologies Inc

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Applications Consumer Electronics Computing and Data Storage

Part Details for V58C2512164SDLJ4

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V58C2512164SDLJ4 Part Data Attributes

V58C2512164SDLJ4 ProMOS Technologies Inc
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V58C2512164SDLJ4 ProMOS Technologies Inc DDR DRAM, 32MX16, CMOS, PBGA60, GREEN, MO-207, FBGA-60
Part Life Cycle Code Obsolete
Ihs Manufacturer PROMOS TECHNOLOGIES INC
Part Package Code DSBGA
Package Description TBGA,
Pin Count 60
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.28
Access Mode FOUR BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B60
Length 12 mm
Memory Density 536870912 bit
Memory IC Type DDR DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 60
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32MX16
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 10 mm

Alternate Parts for V58C2512164SDLJ4

This table gives cross-reference parts and alternative options found for V58C2512164SDLJ4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of V58C2512164SDLJ4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MT46H32M16LGCK-6IT DDR DRAM, 32MX16, 5.5ns, CMOS, PBGA60, 10 X 11.5 MM, LEAD FREE, PLASTIC, VFBGA-60 Micron Technology Inc V58C2512164SDLJ4 vs MT46H32M16LGCK-6IT
V58C2512164SDLJ75E DDR DRAM, 32MX16, CMOS, PBGA60, GREEN, MO-207, FBGA-60 ProMOS Technologies Inc V58C2512164SDLJ4 vs V58C2512164SDLJ75E
MT46H32M16LGBF-54IT:C DDR DRAM, 32MX16, CMOS, PBGA60, 9 X 8 MM, GREEN, PLASTIC, VFBGA-60 Micron Technology Inc V58C2512164SDLJ4 vs MT46H32M16LGBF-54IT:C
MT47H32M16B6-25EL:D DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA60, 10 X 10 MM, ROHS COMPLIANT, FBGA-60 Micron Technology Inc V58C2512164SDLJ4 vs MT47H32M16B6-25EL:D
V58C2512164SDUJ33I DDR DRAM, 32MX16, CMOS, PBGA60, GREEN, MO-207, FBGA-60 ProMOS Technologies Inc V58C2512164SDLJ4 vs V58C2512164SDUJ33I
NT5DS32M16BF-5TI DDR DRAM, 32MX16, 0.65ns, CMOS, PBGA60, 1 MM PITCH, WBGA-60 Nanya Technology Corporation V58C2512164SDLJ4 vs NT5DS32M16BF-5TI
V58C2512164SBLS6 DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, MO-207, FBGA-60 ProMOS Technologies Inc V58C2512164SDLJ4 vs V58C2512164SBLS6
IS43R16320D-5BLI DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, 8 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TFBGA-60 Integrated Silicon Solution Inc V58C2512164SDLJ4 vs IS43R16320D-5BLI
MT46V32M16FN-6TL:F DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, FBGA-60 Micron Technology Inc V58C2512164SDLJ4 vs MT46V32M16FN-6TL:F
V58C2512164SALJ4 DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, GREEN, MO-207, FBGA-60 ProMOS Technologies Inc V58C2512164SDLJ4 vs V58C2512164SALJ4

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