Datasheets
VS12G422TDC-6 by:

Cache SRAM, 256X4, 6ns, MOS, CDIP22, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-22

Part Details for VS12G422TDC-6 by Vitesse Semiconductor Corporation

Overview of VS12G422TDC-6 by Vitesse Semiconductor Corporation

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Applications Space Technology Computing and Data Storage Aerospace and Defense Energy and Power Systems Electronic Manufacturing Renewable Energy Robotics and Drones

Part Details for VS12G422TDC-6

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VS12G422TDC-6 Part Data Attributes

VS12G422TDC-6 Vitesse Semiconductor Corporation
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VS12G422TDC-6 Vitesse Semiconductor Corporation Cache SRAM, 256X4, 6ns, MOS, CDIP22, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-22
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer VITESSE SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP22,.4
Pin Count 22
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 6 ns
I/O Type SEPARATE
JESD-30 Code R-CDIP-T22
JESD-609 Code e0
Length 28 mm
Memory Density 1024 bit
Memory IC Type CACHE SRAM
Memory Width 4
Number of Functions 1
Number of Ports 1
Number of Terminals 22
Number of Words 256 words
Number of Words Code 256
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256X4
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP22,.4
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.064 mm
Supply Current-Max 0.3 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology MOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 10.16 mm

Alternate Parts for VS12G422TDC-6

This table gives cross-reference parts and alternative options found for VS12G422TDC-6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of VS12G422TDC-6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM91L01BDCB Standard SRAM, 256X4, 400ns, MOS, CDIP22, HERMETIC SEALED, CERAMIC, DIP-22 AMD VS12G422TDC-6 vs AM91L01BDCB
M38510/23115BWB 256X4 STANDARD SRAM, 55ns, DIP22, 0.375 X 0.875 INCH, DIP-22 Texas Instruments VS12G422TDC-6 vs M38510/23115BWB
AM91L01ADM Standard SRAM, 256X4, 500ns, NMOS, CDIP22, HERMETIC SEALED, SIDE BRAZED, DIP-22 AMD VS12G422TDC-6 vs AM91L01ADM
C2101A-4 Standard SRAM, 256X4, 400ns, MOS, CDIP22, HERMETIC SEALED, CERAMIC, DIP-22 AMD VS12G422TDC-6 vs C2101A-4
AM91L01A/DMC Standard SRAM, 256X4, 500ns, MOS, CDIP22, HERMETIC SEALED, CERAMIC, DIP-22 AMD VS12G422TDC-6 vs AM91L01A/DMC
MAC5101CS Standard SRAM, 256X4, 130ns, CMOS, CDIP22 Dynex Semiconductor VS12G422TDC-6 vs MAC5101CS
P4C422-10PI Standard SRAM, 256X4, 10ns, CMOS, PDIP22, PLASTIC, DIP-22 Pyramid Semiconductor Corporation VS12G422TDC-6 vs P4C422-10PI
5962-8859403WA Standard SRAM, 256X4, 25ns, CMOS, CDIP22, 0.400 INCH, CERDIP-22 Cypress Semiconductor VS12G422TDC-6 vs 5962-8859403WA
AM93L412ADC Standard SRAM, 256X4, 45ns, TTL, CDIP22, HERMETIC SEALED, CERAMIC, DIP-22 AMD VS12G422TDC-6 vs AM93L412ADC
MAL5101CC Standard SRAM, 256X4, 130ns, CMOS, CDIP22 Dynex Semiconductor VS12G422TDC-6 vs MAL5101CC

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