There are no models available for this part yet.
Overview of W25Q16JVUXIQ by Winbond Electronics Corp
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for W25Q16JVUXIQ by Winbond Electronics Corp
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
Chip 1 Exchange | INSTOCK | 1000 |
|
RFQ | |||
Win Source Electronics | 16Mb SpiFlash Dual/Quad I/O | 407000 |
|
$0.2550 / $0.3820 | Buy Now |
CAD Models for W25Q16JVUXIQ by Winbond Electronics Corp
Part Data Attributes for W25Q16JVUXIQ by Winbond Electronics Corp
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
WINBOND ELECTRONICS CORP
|
Package Description
|
USON-8
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.51
|
Date Of Intro
|
2016-10-04
|
Samacsys Manufacturer
|
Winbond
|
Alternate Memory Width
|
1
|
Clock Frequency-Max (fCLK)
|
133 MHz
|
Data Retention Time-Min
|
20
|
Endurance
|
100000 Write/Erase Cycles
|
JESD-30 Code
|
R-PDSO-N8
|
Length
|
3 mm
|
Memory Density
|
16777216 bit
|
Memory IC Type
|
FLASH
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Terminals
|
8
|
Number of Words
|
2097152 words
|
Number of Words Code
|
2000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
2MX8
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
HVSON
|
Package Equivalence Code
|
SOLCC8,.12,20
|
Package Shape
|
RECTANGULAR
|
Package Style
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Parallel/Serial
|
SERIAL
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Programming Voltage
|
3 V
|
Seated Height-Max
|
0.6 mm
|
Serial Bus Type
|
QSPI
|
Standby Current-Max
|
0.000015 A
|
Supply Current-Max
|
0.02 mA
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
Supply Voltage-Nom (Vsup)
|
3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Form
|
NO LEAD
|
Terminal Pitch
|
0.5 mm
|
Terminal Position
|
DUAL
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Type
|
NOR TYPE
|
Width
|
2 mm
|
Write Protection
|
HARDWARE/SOFTWARE
|
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