Part Details for W25Q256FVFIQ by Winbond Electronics Corp
Overview of W25Q256FVFIQ by Winbond Electronics Corp
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for W25Q256FVFIQ
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
W25Q256FVFIQ-ND
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DigiKey | IC FLASH 256MBIT SPI/QUAD 16SOIC Lead time: 22 Weeks Container: Tube | Limited Supply - Call |
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Part Details for W25Q256FVFIQ
W25Q256FVFIQ CAD Models
W25Q256FVFIQ Part Data Attributes
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W25Q256FVFIQ
Winbond Electronics Corp
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Datasheet
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Compare Parts:
W25Q256FVFIQ
Winbond Electronics Corp
256MX1 FLASH 3V PROM, PDSO16, SOIC-16
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Package Description | SOIC-16 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Samacsys Manufacturer | Winbond | |
Clock Frequency-Max (fCLK) | 80 MHz | |
Data Retention Time-Min | 20 | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PDSO-G16 | |
Length | 10.31 mm | |
Memory Density | 268435456 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Number of Words | 33554432 words | |
Number of Words Code | 32000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP16,.4 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Parallel/Serial | SERIAL | |
Programming Voltage | 3 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.64 mm | |
Serial Bus Type | SPI | |
Standby Current-Max | 0.000025 A | |
Supply Current-Max | 0.025 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Type | NOR TYPE | |
Width | 7.49 mm | |
Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for W25Q256FVFIQ
This table gives cross-reference parts and alternative options found for W25Q256FVFIQ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W25Q256FVFIQ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
W25Q256FVFIG | 256MX1 FLASH 3V PROM, PDSO16, SOIC-16 | Winbond Electronics Corp | W25Q256FVFIQ vs W25Q256FVFIG |