There are no models available for this part yet.
Overview of W27C01-70 by Winbond Electronics Corp
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 3 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 3 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
CAD Models for W27C01-70 by Winbond Electronics Corp
Part Data Attributes for W27C01-70 by Winbond Electronics Corp
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
WINBOND ELECTRONICS CORP
|
Part Package Code
|
DIP
|
Package Description
|
DIP, DIP32,.6
|
Pin Count
|
32
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
3A991.B.1.B.2
|
HTS Code
|
8542.32.00.51
|
Access Time-Max
|
70 ns
|
Command User Interface
|
NO
|
Data Polling
|
NO
|
JESD-30 Code
|
R-PDIP-T32
|
JESD-609 Code
|
e0
|
Length
|
41.91 mm
|
Memory Density
|
1048576 bit
|
Memory IC Type
|
EEPROM
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Terminals
|
32
|
Number of Words
|
131072 words
|
Number of Words Code
|
128000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
128KX8
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
DIP
|
Package Equivalence Code
|
DIP32,.6
|
Package Shape
|
RECTANGULAR
|
Package Style
|
IN-LINE
|
Parallel/Serial
|
PARALLEL
|
Programming Voltage
|
5 V
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
5.33 mm
|
Standby Current-Max
|
0.0001 A
|
Supply Current-Max
|
0.03 mA
|
Supply Voltage-Max (Vsup)
|
5.25 V
|
Supply Voltage-Min (Vsup)
|
4.75 V
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
THROUGH-HOLE
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
DUAL
|
Toggle Bit
|
NO
|
Width
|
15.24 mm
|
Alternate Parts for W27C01-70
This table gives cross-reference parts and alternative options found for W27C01-70. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W27C01-70, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
MX26C1000APC-70 | EEPROM, 128KX8, 70ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Macronix International Co Ltd | W27C01-70 vs MX26C1000APC-70 |
MX26C1000PC-70 | EEPROM, 128KX8, 70ns, Parallel, CMOS, PDIP32 | Macronix International Co Ltd | W27C01-70 vs MX26C1000PC-70 |
W27C010-70 | EEPROM, 128KX8, 70ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Winbond Electronics Corp | W27C01-70 vs W27C010-70 |