Datasheets
W3J128M72G-1333PBCD by:

DDR DRAM, 128MX72, CMOS, PBGA375, 20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375

Part Details for W3J128M72G-1333PBCD by Microsemi Corporation

Overview of W3J128M72G-1333PBCD by Microsemi Corporation

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Part Details for W3J128M72G-1333PBCD

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W3J128M72G-1333PBCD Part Data Attributes

W3J128M72G-1333PBCD Microsemi Corporation
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W3J128M72G-1333PBCD Microsemi Corporation DDR DRAM, 128MX72, CMOS, PBGA375, 20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Part Package Code BGA
Package Description BGA,
Pin Count 375
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.36
Access Mode MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
JESD-30 Code R-PBGA-B375
Length 21.75 mm
Memory Density 9663676416 bit
Memory IC Type DDR DRAM
Memory Width 72
Number of Functions 1
Number of Ports 1
Number of Terminals 375
Number of Words 134217728 words
Number of Words Code 128000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128MX72
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 6 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 1.575 V
Supply Voltage-Min (Vsup) 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 20.75 mm

Alternate Parts for W3J128M72G-1333PBCD

This table gives cross-reference parts and alternative options found for W3J128M72G-1333PBCD. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W3J128M72G-1333PBCD, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
W3J128M72G-1333PBCA DDR DRAM, 128MX72, CMOS, PBGA375, 20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375 Microsemi Corporation W3J128M72G-1333PBCD vs W3J128M72G-1333PBCA
W3J128M72G-800PBCB DDR DRAM, 128MX72, CMOS, PBGA375, 20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375 Mercury Systems Inc W3J128M72G-1333PBCD vs W3J128M72G-800PBCB
W3J128M72G-800PBIB DDR DRAM, 128MX72, CMOS, PBGA375, 20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375 Mercury Systems Inc W3J128M72G-1333PBCD vs W3J128M72G-800PBIB
W3J128M72G-800PBID DDR DRAM, 128MX72, CMOS, PBGA375, 20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375 Mercury Systems Inc W3J128M72G-1333PBCD vs W3J128M72G-800PBID
W3J128M72G-1066PBIC DDR DRAM, 128MX72, CMOS, PBGA375, 20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375 Mercury Systems Inc W3J128M72G-1333PBCD vs W3J128M72G-1066PBIC
W3J128M72G-800PBC DDR DRAM, 128MX72, CMOS, PBGA375, 20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375 Microsemi Corporation W3J128M72G-1333PBCD vs W3J128M72G-800PBC
W3J128M72G-1066PBI DDR DRAM, 128MX72, CMOS, PBGA375, 20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375 Mercury Systems Inc W3J128M72G-1333PBCD vs W3J128M72G-1066PBI
W3J128M72G-1066PBCA DDR DRAM, 128MX72, CMOS, PBGA375, 20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375 Mercury Systems Inc W3J128M72G-1333PBCD vs W3J128M72G-1066PBCA
W3J128M72G-1066PBCD DDR DRAM, 128MX72, CMOS, PBGA375, 20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375 Mercury Systems Inc W3J128M72G-1333PBCD vs W3J128M72G-1066PBCD
W3J128M72G-800PBCC DDR DRAM, 128MX72, CMOS, PBGA375, 20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375 Mercury Systems Inc W3J128M72G-1333PBCD vs W3J128M72G-800PBCC

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