Datasheets
W631GG6KB-12 by: Winbond Electronics Corp

DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, WBGA-96

Part Details for W631GG6KB-12 by Winbond Electronics Corp

Overview of W631GG6KB-12 by Winbond Electronics Corp

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Price & Stock for W631GG6KB-12

Part # Distributor Description Stock Price Buy
Quest Components DDR DRAM, 64MX16, 0.225NS, CMOS, PBGA96 2
  • 1 $5.8500
  • 3 $3.9000
$3.9000 / $5.8500 Buy Now
Quest Components DDR DRAM, 64MX16, 0.225NS, CMOS, PBGA96 10
  • 1 $6.0000
  • 3 $5.0000
  • 6 $4.4000
$4.4000 / $6.0000 Buy Now
Win Source Electronics DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96-Pin WBGA / IC SDRAM 1GBIT 800MHZ 96BGA 13878
  • 20 $2.5440
  • 48 $2.0870
  • 75 $2.0220
  • 103 $1.9570
  • 133 $1.8920
  • 177 $1.6960
$1.6960 / $2.5440 Buy Now

Part Details for W631GG6KB-12

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W631GG6KB-12 Part Data Attributes:

W631GG6KB-12 Winbond Electronics Corp
Buy Now Datasheet
Compare Parts:
W631GG6KB-12 Winbond Electronics Corp DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, WBGA-96
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP
Part Package Code BGA
Package Description WBGA-96
Pin Count 96
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.32
Samacsys Manufacturer Winbond
Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.225 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 800 MHz
I/O Type COMMON
Interleaved Burst Length 8
JESD-30 Code R-PBGA-B96
Length 13 mm
Memory Density 1073741824 bit
Memory IC Type DDR3 DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 96
Number of Words 67108864 words
Number of Words Code 64000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 64MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA96,9X16,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 8
Standby Current-Max 0.014 A
Supply Current-Max 0.4 mA
Supply Voltage-Max (Vsup) 1.575 V
Supply Voltage-Min (Vsup) 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 9 mm

Alternate Parts for W631GG6KB-12

This table gives cross-reference parts and alternative options found for W631GG6KB-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W631GG6KB-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
W631GG6KB12I DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, WBGA-96 Winbond Electronics Corp W631GG6KB-12 vs W631GG6KB12I
W631GG6KB12K DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, 9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96 Winbond Electronics Corp W631GG6KB-12 vs W631GG6KB12K
W631GG6MB12J DDR DRAM, Winbond Electronics Corp W631GG6KB-12 vs W631GG6MB12J
W631GG6MB-12 DDR DRAM, Winbond Electronics Corp W631GG6KB-12 vs W631GG6MB-12
W631GG6MB12I DDR DRAM, Winbond Electronics Corp W631GG6KB-12 vs W631GG6MB12I
Part Number Description Manufacturer Compare
W631GG6MB11J DDR DRAM, Winbond Electronics Corp W631GG6KB-12 vs W631GG6MB11J
W631GG6KB12I DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, WBGA-96 Winbond Electronics Corp W631GG6KB-12 vs W631GG6KB12I
W631GG6MB15I DDR DRAM, Winbond Electronics Corp W631GG6KB-12 vs W631GG6MB15I
W631GG6MB15J DDR DRAM, Winbond Electronics Corp W631GG6KB-12 vs W631GG6MB15J
W631GG6MB11I DDR DRAM, Winbond Electronics Corp W631GG6KB-12 vs W631GG6MB11I
W631GG6KB12K DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, 9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96 Winbond Electronics Corp W631GG6KB-12 vs W631GG6KB12K
W631GG6KB15K DDR DRAM, 64MX16, 0.255ns, CMOS, PBGA96, 9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96 Winbond Electronics Corp W631GG6KB-12 vs W631GG6KB15K
W631GG6MB-12 DDR DRAM, Winbond Electronics Corp W631GG6KB-12 vs W631GG6MB-12
W631GG6MB12I DDR DRAM, Winbond Electronics Corp W631GG6KB-12 vs W631GG6MB12I
W631GG6MB12J DDR DRAM, Winbond Electronics Corp W631GG6KB-12 vs W631GG6MB12J

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