Part Details for W632GG6KB-12 by Winbond Electronics Corp
Overview of W632GG6KB-12 by Winbond Electronics Corp
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Price & Stock for W632GG6KB-12
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
W632GG6KB-12-ND
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DigiKey | IC DRAM 2GBIT PARALLEL 96WBGA Lead time: 28 Weeks Container: Tray | Limited Supply - Call |
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Part Details for W632GG6KB-12
W632GG6KB-12 CAD Models
W632GG6KB-12 Part Data Attributes
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W632GG6KB-12
Winbond Electronics Corp
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Datasheet
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W632GG6KB-12
Winbond Electronics Corp
DDR DRAM, 128MX16, 0.225ns, CMOS, PBGA96, 9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | BGA | |
| Package Description | TFBGA, BGA96,9X16,32 | |
| Pin Count | 96 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Samacsys Manufacturer | Winbond | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.225 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 800 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 8 | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 13 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | DDR3 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 128MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA96,9X16,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 8 | |
| Standby Current-Max | 0.07 A | |
| Supply Current-Max | 0.38 mA | |
| Supply Voltage-Max (Vsup) | 1.575 V | |
| Supply Voltage-Min (Vsup) | 1.425 V | |
| Supply Voltage-Nom (Vsup) | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 9 mm |
Alternate Parts for W632GG6KB-12
This table gives cross-reference parts and alternative options found for W632GG6KB-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W632GG6KB-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W632GG6KB12A | DDR DRAM, 128MX16, 20ns, CMOS, PBGA96, 9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96 | Winbond Electronics Corp | W632GG6KB-12 vs W632GG6KB12A |
| W632GG6KB12I | DDR DRAM, 128MX16, 0.225ns, CMOS, PBGA96, 9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96 | Winbond Electronics Corp | W632GG6KB-12 vs W632GG6KB12I |