Part Details for W632GU6KB15I by Winbond Electronics Corp
Overview of W632GU6KB15I by Winbond Electronics Corp
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for W632GU6KB15I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
W632GU6KB15I-ND
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DigiKey | IC DRAM 2GBIT PAR 96WBGA Lead time: 28 Weeks Container: Tray | Limited Supply - Call |
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Buy Now | |
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NAC | 2Gb DDR3L SDRAM, 1.35V, x16, 667MHz, Industrial Temp, WBGA96 Package RoHS: Compliant Min Qty: 190 Package Multiple: 190 | 0 |
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RFQ |
Part Details for W632GU6KB15I
W632GU6KB15I CAD Models
W632GU6KB15I Part Data Attributes
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W632GU6KB15I
Winbond Electronics Corp
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Datasheet
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W632GU6KB15I
Winbond Electronics Corp
DDR DRAM, 128MX16, 0.255ns, CMOS, PBGA96, WBGA-96
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | BGA | |
| Package Description | WBGA-96 | |
| Pin Count | 96 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.255 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 667 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 8 | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 13 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | DDR3L DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA96,9X16,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 8 | |
| Standby Current-Max | 0.019 A | |
| Supply Current-Max | 0.37 mA | |
| Supply Voltage-Max (Vsup) | 1.45 V | |
| Supply Voltage-Min (Vsup) | 1.283 V | |
| Supply Voltage-Nom (Vsup) | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 9 mm |
Alternate Parts for W632GU6KB15I
This table gives cross-reference parts and alternative options found for W632GU6KB15I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W632GU6KB15I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W632GG6KB15I | DDR DRAM, 128MX16, 0.255ns, CMOS, PBGA96, 9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96 | Winbond Electronics Corp | W632GU6KB15I vs W632GG6KB15I |
| W632GG6KB15A | DDR DRAM, 128MX16, 0.255ns, CMOS, PBGA96, 9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96 | Winbond Electronics Corp | W632GU6KB15I vs W632GG6KB15A |
| W632GU6KB-15 | DDR DRAM, 128MX16, 0.255ns, CMOS, PBGA96, WBGA-96 | Winbond Electronics Corp | W632GU6KB15I vs W632GU6KB-15 |
| W632GG6KB-15 | DDR DRAM, 128MX16, 0.255ns, CMOS, PBGA96, 9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96 | Winbond Electronics Corp | W632GU6KB15I vs W632GG6KB-15 |