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W78M64V-70SBC by:

Flash Module, 8MX64, 70ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159

Part Details for W78M64V-70SBC by White Electronic Designs Corp

Overview of W78M64V-70SBC by White Electronic Designs Corp

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for W78M64V-70SBC

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W78M64V-70SBC Part Data Attributes

W78M64V-70SBC White Electronic Designs Corp
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W78M64V-70SBC White Electronic Designs Corp Flash Module, 8MX64, 70ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP
Package Description 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 70 ns
Additional Feature USER CONFIGURABLE AS 32M X 16
Alternate Memory Width 32
Boot Block BOTTOM/TOP
JESD-30 Code R-PBGA-B159
Memory Density 536870912 bit
Memory IC Type FLASH MODULE
Memory Width 64
Number of Functions 1
Number of Terminals 159
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 8MX64
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Programming Voltage 3.3 V
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Type NOR TYPE

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