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Memory / DRAMs / W97AH6KBVX2I
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W97AH6KBVX2I by: Winbond Electronics Corp

DDR DRAM, 64MX16, CMOS, PBGA134, VFBGA-134

Part Details for W97AH6KBVX2I by Winbond Electronics Corp

Overview of W97AH6KBVX2I by Winbond Electronics Corp

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Price & Stock for W97AH6KBVX2I

Part # Distributor Description Stock Price Buy
DISTI # W97AH6KBVX2I-ND
DigiKey IC DRAM 1GBIT PARALLEL 134VFBGA Lead time: 28 Weeks Container: Tray Temporarily Out of Stock
Buy Now
DISTI # 62140281
Verical DRAM Chip Mobile LPDDR2 SDRAM 1Gbit 64Mx16 1.2V/1.8V 134-Pin VFBGA RoHS: Compliant Min Qty: 2 Package Multiple: 1 Date Code: 1829 Americas - 156
  • 2 $3.5113
$3.5113 Buy Now
NAC 1Gb LPDDR2, x16, 400MHz, -40 ~ 85C, VFBGA 134 Package RoHS: Compliant Min Qty: 168 Package Multiple: 168 0
RFQ
DISTI # W97AH6KBVX2I
Avnet Asia 1GB, 134VFBGA, X16, -40°C/+85°C (Alt: W97AH6KBVX2I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 20 Weeks, 0 Days 0
RFQ
DISTI # C1S810600019319
Chip1Stop DRAM Chip DDR SDRAM 1Gbit 64Mx16 1.2V/1.8V RoHS: Compliant pbFree: Yes 156
  • 1 $4.2700
$4.2700 Buy Now

Part Details for W97AH6KBVX2I

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W97AH6KBVX2I Part Data Attributes

Parametric Data
W97AH6KBVX2I Winbond Electronics Corp
Buy Now Datasheet
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W97AH6KBVX2I Winbond Electronics Corp DDR DRAM, 64MX16, CMOS, PBGA134, VFBGA-134
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP
Package Description VFBGA-134
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.32
Samacsys Manufacturer Winbond
Access Mode MULTI BANK PAGE BURST
Additional Feature SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
JESD-30 Code R-PBGA-B134
Length 11.5 mm
Memory Density 1073741824 bit
Memory IC Type LPDDR2 DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 134
Number of Words 67108864 words
Number of Words Code 64000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 64MX16
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Refresh Cycles 8192
Seated Height-Max 1 mm
Self Refresh YES
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 1.3 V
Supply Voltage-Min (Vsup) 1.14 V
Supply Voltage-Nom (Vsup) 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.65 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10 mm

Alternate Parts for W97AH6KBVX2I

This table gives cross-reference parts and alternative options found for W97AH6KBVX2I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W97AH6KBVX2I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
W97AH6KBVX2E DDR DRAM, 64MX16, CMOS, PBGA134, VFBGA-134 Winbond Electronics Corp W97AH6KBVX2I vs W97AH6KBVX2E

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