Part Details for WE512K8250CI by Microsemi Corporation
Overview of WE512K8250CI by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (9 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for WE512K8250CI
WE512K8250CI CAD Models
WE512K8250CI Part Data Attributes:
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WE512K8250CI
Microsemi Corporation
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Datasheet
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WE512K8250CI
Microsemi Corporation
EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | DIP | |
| Package Description | HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.1.B.1 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 250 ns | |
| JESD-30 Code | R-CDIP-T32 | |
| JESD-609 Code | e4 | |
| Memory Density | 4194304 bit | |
| Memory IC Type | EEPROM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | GOLD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.5 mm | |
| Terminal Position | DUAL | |
| Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for WE512K8250CI
This table gives cross-reference parts and alternative options found for WE512K8250CI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WE512K8250CI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WE512K8-250CI | EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | WE512K8250CI vs WE512K8-250CI |
| WE512K8-250CQ | EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WE512K8250CI vs WE512K8-250CQ |
| WE512K8250CCA | EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WE512K8250CI vs WE512K8250CCA |
| WE512K8250CM | EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WE512K8250CI vs WE512K8250CM |
| WE512K8250CQA | EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WE512K8250CI vs WE512K8250CQA |
| WE512K8250CM | EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | WE512K8250CI vs WE512K8250CM |
| 5962-9309103HYX | EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDIP32, DIP-32 | Mercury Systems Inc | WE512K8250CI vs 5962-9309103HYX |
| WE512K8250CIA | EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WE512K8250CI vs WE512K8250CIA |
| 5962-9309103HYX | EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDIP32, DIP-32 | Microsemi Corporation | WE512K8250CI vs 5962-9309103HYX |