Part Details for WME128K8-250CCEA by Microsemi Corporation
Overview of WME128K8-250CCEA by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for WME128K8-250CCEA
WME128K8-250CCEA CAD Models
WME128K8-250CCEA Part Data Attributes
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WME128K8-250CCEA
Microsemi Corporation
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Datasheet
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WME128K8-250CCEA
Microsemi Corporation
EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 250 ns | |
| Additional Feature | WRITE ENDURANCE 10000 CYCLES; 10 YEARS DATA RETENTION; HARDWARE AND SOFTWARE DATA PROTECTION | |
| Data Retention Time-Min | 10 | |
| Endurance | 10000 Write/Erase Cycles | |
| JESD-30 Code | R-CDIP-T32 | |
| Memory Density | 1048576 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.13 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for WME128K8-250CCEA
This table gives cross-reference parts and alternative options found for WME128K8-250CCEA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WME128K8-250CCEA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-9679602HYC | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 | Mercury Systems Inc | WME128K8-250CCEA vs 5962-9679602HYC |
| 5962-9679602HYA | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 | Microsemi Corporation | WME128K8-250CCEA vs 5962-9679602HYA |
| WME128K8-250CMA | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WME128K8-250CCEA vs WME128K8-250CMA |
| WME128K8-250CI | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | WME128K8-250CCEA vs WME128K8-250CI |
| CM28C010H-250 | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32 | LSI Corporation | WME128K8-250CCEA vs CM28C010H-250 |
| CQ28C010-250 | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32 | LSI Corporation | WME128K8-250CCEA vs CQ28C010-250 |
| WME128K8-250CM | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WME128K8-250CCEA vs WME128K8-250CM |
| WME128K8-250CQ | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WME128K8-250CCEA vs WME128K8-250CQ |
| WME128K8-250CC | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WME128K8-250CCEA vs WME128K8-250CC |
| WPE128K8C-250WM | EEPROM, 128KX8, 250ns, Parallel, CMOS, PDIP32, | White Microelectronics | WME128K8-250CCEA vs WPE128K8C-250WM |