There are no models available for this part yet.
Overview of X28C010DI-25 by Intersil Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Renewable Energy
Robotics and Drones
CAD Models for X28C010DI-25 by Intersil Corporation
Part Data Attributes for X28C010DI-25 by Intersil Corporation
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
INTERSIL CORP
|
|
Part Package Code
|
DIP
|
|
Pin Count
|
32
|
|
Reach Compliance Code
|
not_compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.51
|
|
Access Time-Max
|
250 ns
|
|
Additional Feature
|
PAGE WRITE
|
|
Command User Interface
|
NO
|
|
Data Polling
|
YES
|
|
JESD-30 Code
|
R-GDIP-T32
|
|
JESD-609 Code
|
e0
|
|
Memory Density
|
1048576 bit
|
|
Memory IC Type
|
EEPROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
32
|
|
Number of Words
|
131072 words
|
|
Number of Words Code
|
128000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
128KX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
CERAMIC, GLASS-SEALED
|
|
Package Code
|
DIP
|
|
Package Equivalence Code
|
DIP32,.6
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE
|
|
Page Size
|
256 words
|
|
Parallel/Serial
|
PARALLEL
|
|
Programming Voltage
|
5 V
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
5.9 mm
|
|
Standby Current-Max
|
0.0005 A
|
|
Supply Current-Max
|
0.05 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Toggle Bit
|
YES
|
|
Width
|
15.24 mm
|
|
Write Cycle Time-Max (tWC)
|
10 ms
|
Alternate Parts for X28C010DI-25
This table gives cross-reference parts and alternative options found for X28C010DI-25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X28C010DI-25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-3826701MXA | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 | Micross Components | X28C010DI-25 vs 5962-3826701MXA |
| FT28C010-25CMB-X | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, DIP-32 | Force Technologies Ltd | X28C010DI-25 vs FT28C010-25CMB-X |
| 5962-3826701MXB | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 | Xicor Inc | X28C010DI-25 vs 5962-3826701MXB |
| 5962-3826701MXX | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERDIP-32 | Teledyne e2v | X28C010DI-25 vs 5962-3826701MXX |
| FT28C010-25CM-AT | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, DIP-32 | Force Technologies Ltd | X28C010DI-25 vs FT28C010-25CM-AT |
| X28C010C-25 | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, SIDE BRAZED, DIP-32 | Xicor Inc | X28C010DI-25 vs X28C010C-25 |
| FT28C010-25CMB-AT | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, DIP-32 | Force Technologies Ltd | X28C010DI-25 vs FT28C010-25CMB-AT |
| X28C010DI-25 | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, CERDIP-32 | Xicor Inc | X28C010DI-25 vs X28C010DI-25 |
| X28C010DM-25 | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, CERDIP-32 | Xicor Inc | X28C010DI-25 vs X28C010DM-25 |
| 5962-3826701MXA | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 | Teledyne e2v | X28C010DI-25 vs 5962-3826701MXA |