Part Details for XC17256EPCG20I by AMD Xilinx
Overview of XC17256EPCG20I by AMD Xilinx
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for XC17256EPCG20I
XC17256EPCG20I CAD Models
XC17256EPCG20I Part Data Attributes
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XC17256EPCG20I
AMD Xilinx
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Datasheet
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XC17256EPCG20I
AMD Xilinx
Configuration Memory, 256KX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QLCC | |
| Package Description | QCCJ, | |
| Pin Count | 20 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Additional Feature | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | |
| JESD-30 Code | S-PQCC-J20 | |
| JESD-609 Code | e3 | |
| Length | 8.9662 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | CONFIGURATION MEMORY | |
| Memory Width | 1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX1 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.572 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 8.9662 mm |
Alternate Parts for XC17256EPCG20I
This table gives cross-reference parts and alternative options found for XC17256EPCG20I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC17256EPCG20I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XC17256EPC20I | Configuration Memory, 256KX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20 | AMD Xilinx | XC17256EPCG20I vs XC17256EPC20I |
| XC17256D-PC20C | 256KX1 CONFIGURATION MEMORY, PQCC20, PLASTIC, LCC-20 | AMD Xilinx | XC17256EPCG20I vs XC17256D-PC20C |
| XC17256DPC20C | Configuration Memory, 256KX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20 | AMD Xilinx | XC17256EPCG20I vs XC17256DPC20C |