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Memory EEPROMs XC17S150APD8C

Memory
XC17S150APD8C
AMD Xilinx
Description: Configuration Memory, 1040096X1, Serial, CMOS, PDIP8, PLASTIC, DIP-8

Overview of XC17S150APD8C by AMD Xilinx

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Computing and Data Storage

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Part Data Attributes for XC17S150APD8C by AMD Xilinx
Parametric Data

XC17S150APD8C
AMD Xilinx
Buy Now
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
XILINX INC
Part Package Code
DIP
Package Description
PLASTIC, DIP-8
Pin Count
8
Reach Compliance Code
not_compliant
ECCN Code
EAR99
HTS Code
8542.32.00.61
I/O Type
COMMON
JESD-30 Code
R-PDIP-T8
JESD-609 Code
e0
Length
9.3599 mm
Memory Density
1040096 bit
Memory IC Type
CONFIGURATION MEMORY
Memory Width
1
Moisture Sensitivity Level
1
Number of Functions
1
Number of Terminals
8
Number of Words
1040096 words
Number of Words Code
1040096
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
1040096X1
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
SERIAL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Seated Height-Max
4.5974 mm
Standby Current-Max
0.00005 A
Supply Current-Max
0.005 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
7.62 mm
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  1. XC17S150APD8C
    AMD Xilinx
    Configuration Memory, 1040096X1, Serial, CMOS, PDIP8, PLASTIC, DIP-8
    VS

Alternate Parts for XC17S150APD8C

This table gives cross-reference parts and alternative options found for XC17S150APD8C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC17S150APD8C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
XC17S150APD8I Configuration Memory, 1040096X1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 AMD Xilinx XC17S150APD8C vs XC17S150APD8I
XC17S150APDG8I Configuration Memory, 1040096X1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 AMD Xilinx XC17S150APD8C vs XC17S150APDG8I
Part Number Description Manufacturer Compare
PCB2421P IC I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 MIL, PLASTIC, MO-001-AN, SOT-97-1, DIP-8, Programmable ROM NXP Semiconductors XC17S150APD8C vs PCB2421P
XC17S150APDG8I Configuration Memory, 1040096X1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 AMD Xilinx XC17S150APD8C vs XC17S150APDG8I
BR24C21-E2 EEPROM, PDIP8, DIP-8 ROHM Semiconductor XC17S150APD8C vs BR24C21-E2
BR24T32-WG EEPROM, 4KX8, Serial, CMOS, PDIP8, HALOGEN FREE AND ROHS COMPLIANT, DIP-8 ROHM Semiconductor XC17S150APD8C vs BR24T32-WG
BR24T128-WZ EEPROM, ROHM Semiconductor XC17S150APD8C vs BR24T128-WZ
XC17S150APD8I Configuration Memory, 1040096X1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 AMD Xilinx XC17S150APD8C vs XC17S150APD8I

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