Part Details for XC17S150APDG8C by AMD Xilinx
Overview of XC17S150APDG8C by AMD Xilinx
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for XC17S150APDG8C
XC17S150APDG8C CAD Models
XC17S150APDG8C Part Data Attributes
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XC17S150APDG8C
AMD Xilinx
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Datasheet
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XC17S150APDG8C
AMD Xilinx
Configuration Memory, 1040096X1, Serial, CMOS, PDIP8, PLASTIC, DIP-8
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | DIP | |
Package Description | DIP, | |
Pin Count | 8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
JESD-30 Code | R-PDIP-T8 | |
JESD-609 Code | e3 | |
Length | 9.3599 mm | |
Memory Density | 1040096 bit | |
Memory IC Type | CONFIGURATION MEMORY | |
Memory Width | 1 | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 1040096 words | |
Number of Words Code | 1040096 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 1040096X1 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | 250 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 4.5974 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 7.62 mm |
Alternate Parts for XC17S150APDG8C
This table gives cross-reference parts and alternative options found for XC17S150APDG8C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC17S150APDG8C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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XC17S150APD8I | Configuration Memory, 1040096X1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC17S150APDG8C vs XC17S150APD8I |
XC17S150APDG8I | Configuration Memory, 1040096X1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC17S150APDG8C vs XC17S150APDG8I |