Part Details for XC3S700A-4FGG484C by AMD Xilinx
Results Overview of XC3S700A-4FGG484C by AMD Xilinx
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (7 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (10 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Computing and Data Storage
XC3S700A-4FGG484C Information
XC3S700A-4FGG484C by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC3S700A-4FGG484C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 7 |
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RFQ | ||
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Win Source Electronics | FPGA Spartan®-3A Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V 484-Pin FBGA Tray / IC FPGA 372 I/O 484FBGA | 6120 |
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$23.3256 / $34.9884 | Buy Now |
US Tariff Estimator: XC3S700A-4FGG484C by AMD Xilinx
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for XC3S700A-4FGG484C
XC3S700A-4FGG484C Part Data Attributes
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XC3S700A-4FGG484C
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XC3S700A-4FGG484C
AMD Xilinx
Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 250MHz, 13248-Cell, CMOS, PBGA484, LEAD FREE, FPBGA-484
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Part Package Code | BGA | |
| Package Description | Bga, Bga484,22x22,40 | |
| Pin Count | 484 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 35 Weeks | |
| Clock Frequency-Max | 667 Mhz | |
| Combinatorial Delay of a CLB-Max | 0.71 Ns | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e1 | |
| Length | 23 Mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1472 | |
| Number of Equivalent Gates | 700000 | |
| Number of Inputs | 372 | |
| Number of Logic Cells | 13248 | |
| Number of Outputs | 288 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 1472 Clbs, 700000 Gates | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | Square | |
| Package Style | Grid Array | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | Field Programmable Gate Array | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.6 Mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Other | |
| Terminal Finish | Tin Silver Copper | |
| Terminal Form | Ball | |
| Terminal Pitch | 1 Mm | |
| Terminal Position | Bottom | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 Mm |
Alternate Parts for XC3S700A-4FGG484C
This table gives cross-reference parts and alternative options found for XC3S700A-4FGG484C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S700A-4FGG484C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC3S700A-4FGG484I | AMD Xilinx | $57.5484 | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 250MHz, 13248-Cell, CMOS, PBGA484, LEAD FREE, FPBGA-484 | XC3S700A-4FGG484C vs XC3S700A-4FGG484I |
| XC3S700AN-4FGG484C | AMD | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA484, FBGA-484 | XC3S700A-4FGG484C vs XC3S700AN-4FGG484C |
| XC3S700AN-4FG484C | AMD Xilinx | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 280MHz, 13248-Cell, CMOS, PBGA484, 23 X 23 MM, FBGA-484 | XC3S700A-4FGG484C vs XC3S700AN-4FG484C |
| XC3S700AN-4FGG484I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 280MHz, 13248-Cell, CMOS, PBGA484, 23 X 23 MM, ROHS COMPLIANT, FBGA-484 | XC3S700A-4FGG484C vs XC3S700AN-4FGG484I |
| XC3S700A-4FGG484I | AMD | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA484, FBGA-484 | XC3S700A-4FGG484C vs XC3S700A-4FGG484I |
| XC3S700AN-4FG484I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 280MHz, 13248-Cell, CMOS, PBGA484, 23 X 23 MM, FBGA-484 | XC3S700A-4FGG484C vs XC3S700AN-4FG484I |
| XC3S700AN-4FG484C | AMD | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA484, FBGA-484 | XC3S700A-4FGG484C vs XC3S700AN-4FG484C |
XC3S700A-4FGG484C Frequently Asked Questions (FAQ)
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The maximum power consumption of XC3S700A-4FGG484C is approximately 1.5W, but it can vary depending on the design and operating conditions.
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To implement a CDC in XC3S700A-4FGG484C, you can use the Xilinx-provided IP cores, such as the Clock Domain Crossing (CDC) IP, or implement a custom CDC using FIFOs and synchronization logic.
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The maximum frequency of the XC3S700A-4FGG484C is approximately 340 MHz, but it can vary depending on the design and operating conditions.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to analyze and optimize your design. You can also use power-saving features such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
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The XC3S700A-4FGG484C has a total of 456 user I/O pins, but the actual number of available I/O pins depends on the package and the design requirements.