Part Details for XPC860DTZP50D3 by Freescale Semiconductor
Overview of XPC860DTZP50D3 by Freescale Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for XPC860DTZP50D3
XPC860DTZP50D3 CAD Models
XPC860DTZP50D3 Part Data Attributes
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XPC860DTZP50D3
Freescale Semiconductor
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Datasheet
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XPC860DTZP50D3
Freescale Semiconductor
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 357 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 5A991 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 50 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B357 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 357 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.05 mm | |
| Speed | 50 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for XPC860DTZP50D3
This table gives cross-reference parts and alternative options found for XPC860DTZP50D3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC860DTZP50D3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC860ENCVR50D4 | PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, PCMCIA, -40 to 95C | Freescale Semiconductor | XPC860DTZP50D3 vs MPC860ENCVR50D4 |
| TSPC860MHVZPU50C1 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC860DTZP50D3 vs TSPC860MHVZPU50C1 |
| MPC860DECZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | XPC860DTZP50D3 vs MPC860DECZQ50D4 |
| MPC860SRCZP50D4 | MPC860SRCZP50D4 | Motorola Semiconductor Products | XPC860DTZP50D3 vs MPC860SRCZP50D4 |
| MPC860SRZQ50D4R2 | RISC Microprocessor | NXP Semiconductors | XPC860DTZP50D3 vs MPC860SRZQ50D4R2 |
| MPC860SRCZQ50D4 | PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, -40 to 95C | Freescale Semiconductor | XPC860DTZP50D3 vs MPC860SRCZQ50D4 |
| TSXPC860MHVZPU50C1 | RISC Microprocessor, 32-Bit, 50MHz, PBGA357 | Microchip Technology Inc | XPC860DTZP50D3 vs TSXPC860MHVZPU50C1 |
| MPC860TCVR50D4 | PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, -40 to 95C | Freescale Semiconductor | XPC860DTZP50D3 vs MPC860TCVR50D4 |
| MPC855TZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | XPC860DTZP50D3 vs MPC855TZQ50D4 |
| XPC860PZP50D3 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | XPC860DTZP50D3 vs XPC860PZP50D3 |