Part Details for XQF32PVOG48M by AMD Xilinx
Overview of XQF32PVOG48M by AMD Xilinx
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Part Details for XQF32PVOG48M
XQF32PVOG48M CAD Models
XQF32PVOG48M Part Data Attributes
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XQF32PVOG48M
AMD Xilinx
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Datasheet
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XQF32PVOG48M
AMD Xilinx
Configuration Memory, 32MX1, 30ns, Parallel/serial, CMOS, PDSO48, PLASTIC, TSOP-48
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | TSOP | |
| Package Description | PLASTIC, TSOP-48 | |
| Pin Count | 48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 | |
| Access Time-Max | 30 ns | |
| Data Retention Time-Min | 20 | |
| Endurance | 20000 Write/Erase Cycles | |
| JESD-30 Code | R-PDSO-G48 | |
| JESD-609 Code | e4 | |
| Memory Density | 33554432 bit | |
| Memory IC Type | CONFIGURATION MEMORY | |
| Memory Width | 1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32MX1 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | TSSOP48,.8,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | PARALLEL/SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Supply Current-Max | 0.04 mA | |
| Supply Voltage-Max (Vsup) | 2 V | |
| Supply Voltage-Min (Vsup) | 1.65 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Type | NOR TYPE |