Part Details for AM27C256-150JC by Rochester Electronics LLC
Overview of AM27C256-150JC by Rochester Electronics LLC
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
AM27C256-55DM/B | Rochester Electronics | AM27C256 - 256K (32KX8) CMOS EPROM | |
AM27C256-120PC-G | Rochester Electronics | AM27C256 - 256Kb (32K x 8-Bit) CMOS OTP EPROM | |
AM27C256-150DI | Rochester Electronics LLC | Replacement for AMD part number AM27C256-150DI. Buy from authorized manufacturer Rochester Electronics. |
Part Details for AM27C256-150JC
AM27C256-150JC CAD Models
AM27C256-150JC Part Data Attributes
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AM27C256-150JC
Rochester Electronics LLC
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Datasheet
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AM27C256-150JC
Rochester Electronics LLC
OTP ROM, 32KX8, 150ns, CMOS, PQCC32, LCC-32
|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
Package Description | LCC-32 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 100 ns | |
JESD-30 Code | R-PQCC-J32 | |
Length | 13.97 mm | |
Memory Density | 16384 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 32768 words | |
Number of Words Code | 2000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 2KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 3.55 mm | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 11.43 mm |