Datasheets
AM27S13A/BEA by: AMD

OTP ROM, 512X4, 40ns, Bipolar, CDIP16, CERAMIC, DIP-16

Part Details for AM27S13A/BEA by AMD

Overview of AM27S13A/BEA by AMD

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage Aerospace and Defense

Price & Stock for AM27S13A/BEA

Part # Distributor Description Stock Price Buy
Bristol Electronics   20
RFQ

Part Details for AM27S13A/BEA

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AM27S13A/BEA Part Data Attributes:

AM27S13A/BEA AMD
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AM27S13A/BEA AMD OTP ROM, 512X4, 40ns, Bipolar, CDIP16, CERAMIC, DIP-16
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 200 ns
JESD-30 Code R-GDIP-T16
JESD-609 Code e0
Length 19.431 mm
Memory Density 262144 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 16
Number of Words 512 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Supply Current-Max 0.13 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for AM27S13A/BEA

This table gives cross-reference parts and alternative options found for AM27S13A/BEA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S13A/BEA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27S12A/BEA OTP ROM, 512X4, 40ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD AM27S13A/BEA vs AM27S12A/BEA
Part Number Description Manufacturer Compare
S82S131F IC OTPROM, Programmable ROM NXP Semiconductors AM27S13A/BEA vs S82S131F
DM54S571BJ 512X4 OTPROM, 50ns, CDIP16, CERAMIC, DIP-16 Texas Instruments AM27S13A/BEA vs DM54S571BJ
AM27S12DCB OTP ROM, 512X4, 50ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD AM27S13A/BEA vs AM27S12DCB
AM27S13APCB OTP ROM, 512X4, 30ns, Bipolar, PDIP16, PLASTIC, DIP-16 AMD AM27S13A/BEA vs AM27S13APCB
S82S130F IC 512 X 4 OTPROM, 70 ns, CDIP16, Programmable ROM NXP Semiconductors AM27S13A/BEA vs S82S130F
N82S130AN IC 512 X 4 OTPROM, 33 ns, PDIP16, Programmable ROM NXP Semiconductors AM27S13A/BEA vs N82S130AN
S82S231F 512X4 OTPROM, 70ns, CDIP16 Philips Semiconductors AM27S13A/BEA vs S82S231F
DM74S571J 512X4 OTPROM, 55ns, CDIP16, CERAMIC, DIP-16 Texas Instruments AM27S13A/BEA vs DM74S571J
N82S230F OTP ROM, 512X4, 50ns, Bipolar, CDIP16 Signetics AM27S13A/BEA vs N82S230F
82S130/BEA OTP ROM, 512X4, 60ns, Bipolar, CDIP16 YAGEO Corporation AM27S13A/BEA vs 82S130/BEA

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