There are no models available for this part yet.
Overview of AM27S13ADC by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 4 listings )
- Number of FFF Equivalents: ( 6 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Price & Stock for AM27S13ADC by AMD
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
| Bristol Electronics | 72 |
|
RFQ | ||||
| Quest Components | PROM, 512 x 4, 16 Pin, Ceramic, DIP | 492 |
|
$19.3750 / $25.0000 | Buy Now | ||
| Quest Components | PROM, 512 x 4, 16 Pin, Ceramic, DIP | 57 |
|
$21.2500 / $25.0000 | Buy Now | ||
| Quest Components | PROM, 512 x 4, 16 Pin, Ceramic, DIP | 2 |
|
$56.8946 | Buy Now |
CAD Models for AM27S13ADC by AMD
Part Data Attributes for AM27S13ADC by AMD
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
|
Part Package Code
|
DIP
|
|
Package Description
|
DIP, DIP16,.3
|
|
Pin Count
|
16
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.71
|
|
Access Time-Max
|
200 ns
|
|
JESD-30 Code
|
R-GDIP-T16
|
|
JESD-609 Code
|
e0
|
|
Length
|
19.431 mm
|
|
Memory Density
|
1048576 bit
|
|
Memory IC Type
|
OTP ROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
16
|
|
Number of Words
|
512 words
|
|
Number of Words Code
|
128000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
75 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
128KX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
CERAMIC, GLASS-SEALED
|
|
Package Code
|
DIP
|
|
Package Equivalence Code
|
DIP16,.3
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
5.08 mm
|
|
Supply Current-Max
|
0.13 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
BIPOLAR
|
|
Temperature Grade
|
COMMERCIAL EXTENDED
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Width
|
7.62 mm
|
Alternate Parts for AM27S13ADC
This table gives cross-reference parts and alternative options found for AM27S13ADC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S13ADC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| N82S131ANB | 512X4 OTPROM, 30ns, PDIP16 | Philips Semiconductors | AM27S13ADC vs N82S131ANB |
| N82S131ANB | IC 512 X 4 OTPROM, 30 ns, PDIP16, Programmable ROM | NXP Semiconductors | AM27S13ADC vs N82S131ANB |
| AM27S12ADC | OTP ROM, 512X4, 30ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | AM27S13ADC vs AM27S12ADC |
| AM27S12ADCB | OTP ROM, 512X4, 30ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | AM27S13ADC vs AM27S12ADCB |
| N82S131AN | OTP ROM, 512X4, 30ns, Bipolar, PDIP16 | Signetics | AM27S13ADC vs N82S131AN |
| N82S131AN | IC 512 X 4 OTPROM, 30 ns, PDIP16, Programmable ROM | NXP Semiconductors | AM27S13ADC vs N82S131AN |