Datasheets
AM27S32DC by: AMD

OTP ROM, 1KX4, 55ns, Bipolar, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18

Part Details for AM27S32DC by AMD

Overview of AM27S32DC by AMD

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Price & Stock for AM27S32DC

Part # Distributor Description Stock Price Buy
Bristol Electronics   60
RFQ
Quest Components PROM, 1K x 4, 18 Pin, Ceramic, DIP 22
  • 1 $15.0000
  • 2 $10.0000
  • 4 $7.5000
$7.5000 / $15.0000 Buy Now

Part Details for AM27S32DC

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AM27S32DC Part Data Attributes

AM27S32DC AMD
Buy Now Datasheet
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AM27S32DC AMD OTP ROM, 1KX4, 55ns, Bipolar, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP, DIP18,.3
Pin Count 18
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 120 ns
JESD-30 Code R-GDIP-T18
JESD-609 Code e0
Length 22.86 mm
Memory Density 131072 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 18
Number of Words 1024 words
Number of Words Code 16000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 75 °C
Operating Temperature-Min
Organization 16KX8
Output Characteristics OPEN-COLLECTOR
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP18,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for AM27S32DC

This table gives cross-reference parts and alternative options found for AM27S32DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S32DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
53S441J883B OTP ROM, 1KX4, 55ns, CMOS, CDIP18, Monolithic Memories (RETIRED) AM27S32DC vs 53S441J883B
AM27S33DC OTP ROM, 1KX4, 55ns, Bipolar, CDIP18, CERAMIC, DIP-18 AMD AM27S32DC vs AM27S33DC
82S137A/BVA IC 1K X 4 OTPROM, 55 ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18, Programmable ROM NXP Semiconductors AM27S32DC vs 82S137A/BVA
53S440J883B OTP ROM, 1KX4, 55ns, CMOS, CDIP18, Monolithic Memories (RETIRED) AM27S32DC vs 53S440J883B
AM27S32DCB OTP ROM, 1KX4, 55ns, Bipolar, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18 AMD AM27S32DC vs AM27S32DCB
AM27S32PC OTP ROM, 1KX4, 55ns, Bipolar, PDIP18, PLASTIC, DIP-18 AMD AM27S32DC vs AM27S32PC
AM27S33PC OTP ROM, 1KX4, 55ns, Bipolar, PDIP18, PLASTIC, DIP-18 AMD AM27S32DC vs AM27S33PC
Part Number Description Manufacturer Compare
53S441W OTP ROM, 1KX4, 55ns, CMOS, CDFP18, Monolithic Memories (RETIRED) AM27S32DC vs 53S441W
82S137/BVA OTP ROM, 1KX4, 70ns, Bipolar, CDIP18 YAGEO Corporation AM27S32DC vs 82S137/BVA
N82S137BN OTP ROM, 1KX4, 35ns, Bipolar, PDIP24 Signetics AM27S32DC vs N82S137BN
63S440N OTP ROM, 1KX4, 45ns, CMOS, PDIP18, Monolithic Memories (RETIRED) AM27S32DC vs 63S440N
82S137A/BYA IC 1K X 4 OTPROM, 55 ns, CDFP18, CERAMIC, FP-18, Programmable ROM NXP Semiconductors AM27S32DC vs 82S137A/BYA
AM27S32FC OTP ROM, 1KX4, 55ns, Bipolar, CDFP18, CERAMIC, FP-18 AMD AM27S32DC vs AM27S32FC
DM74S573AN 1KX4 OTPROM, 45ns, PDIP18, PLASTIC, DIP-18 Texas Instruments AM27S32DC vs DM74S573AN
M54741AP-2 OTP ROM, 1KX4, 35ns, Bipolar, PDIP18, PLASTIC, DIP-18 Mitsubishi Electric AM27S32DC vs M54741AP-2
53S441F883B OTP ROM, 1KX4, 55ns, CMOS, MQFP18, Monolithic Memories (RETIRED) AM27S32DC vs 53S441F883B
53S440F883B OTP ROM, 1KX4, 55ns, CMOS, MQFP18, Monolithic Memories (RETIRED) AM27S32DC vs 53S440F883B

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