Part Details for AS4C256M8D3-12BCN by Alliance Memory Inc
Overview of AS4C256M8D3-12BCN by Alliance Memory Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Price & Stock for AS4C256M8D3-12BCN
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
1450-1100-ND
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DigiKey | IC DRAM 2GBIT PARALLEL 78FBGA Lead time: 4 Weeks Container: Tray | Limited Supply - Call |
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Buy Now |
Part Details for AS4C256M8D3-12BCN
AS4C256M8D3-12BCN CAD Models
AS4C256M8D3-12BCN Part Data Attributes:
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AS4C256M8D3-12BCN
Alliance Memory Inc
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Datasheet
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AS4C256M8D3-12BCN
Alliance Memory Inc
DDR DRAM, 256MX8, CMOS, PBGA78, 8 X 10.50 MM, 1.20 MM HEIGHT, ROHS COMPLIANT, FBGA-78
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ALLIANCE MEMORY INC | |
Package Description | TFBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Samacsys Manufacturer | Alliance Memory | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH | |
JESD-30 Code | R-PBGA-B78 | |
Length | 10.5 mm | |
Memory Density | 2147483648 bit | |
Memory IC Type | DDR3 DRAM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 78 | |
Number of Words | 268435456 words | |
Number of Words Code | 256000000 | |
Operating Mode | SYNCHRONOUS | |
Organization | 256MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 1.575 V | |
Supply Voltage-Min (Vsup) | 1.425 V | |
Supply Voltage-Nom (Vsup) | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 8 mm |