Part Details for AS4C512M16D3LC-10BIN by Alliance Memory Inc
Overview of AS4C512M16D3LC-10BIN by Alliance Memory Inc
- Distributor Offerings: (9 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for AS4C512M16D3LC-10BIN
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK7046
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Newark | Ddr3L, 8G, 512M X 16, 1.35V, 96-Ball Fbga, 933Mhz Industrial Temp (Mt41K512M16Ha-125It:A) |Alliance Memory AS4C512M16D3LC-10BIN Min Qty: 190 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$25.6000 / $26.0000 | Buy Now |
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DISTI #
1450-AS4C512M16D3LC-10BIN-ND
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DigiKey | IC DRAM 8GBIT PARALLEL 96FBGA Min Qty: 1 Lead time: 8 Weeks Container: Tray |
190 In Stock |
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$18.5954 / $24.4000 | Buy Now |
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DISTI #
AS4C512M16D3LC-10B
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Avnet Americas | DRAM Chip DDR3L SDRAM 8Gbit 512M X 16 1.35V 96-Pin FBGA Tray - Trays (Alt: AS4C512M16D3LC-10B) RoHS: Not Compliant Min Qty: 190 Package Multiple: 190 Lead time: 8 Weeks, 0 Days Container: Tray | 17404 Factory Stock |
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$23.4000 | Buy Now |
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DISTI #
913-C512M16D3LC10BIN
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Mouser Electronics | DRAM DDR3L, 8G, 512M X 16, 1.35V, 96-BALL FBGA, 933MHZ INDUSTRIAL TEMP (MT41K512M16HA-125IT:A) RoHS: Compliant | 0 |
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$18.0500 | Order Now |
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Future Electronics | DDR3 8G - (DDP)512M x 16 1.35V I TEMP (-40 -95C)933MHz 1866Mbps/pin 96BALL FBGA RoHS: Compliant pbFree: Yes Min Qty: 1 Package Multiple: 1 Container: Tray | 170Tray |
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$17.7000 / $18.5900 | Buy Now |
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Future Electronics | DDR3 8G - (DDP)512M x 16 1.35V I TEMP (-40 -95C)933MHz 1866Mbps/pin 96BALL FBGA RoHS: Compliant pbFree: Yes Min Qty: 190 Package Multiple: 190 Container: Tray | 0Tray |
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$17.7000 | Buy Now |
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DISTI #
AS4C512M16D3LC-10B
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Avnet Americas | DRAM Chip DDR3L SDRAM 8Gbit 512M X 16 1.35V 96-Pin FBGA Tray - Trays (Alt: AS4C512M16D3LC-10B) RoHS: Not Compliant Min Qty: 190 Package Multiple: 190 Lead time: 8 Weeks, 0 Days Container: Tray | 17404 Factory Stock |
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$23.4000 | Buy Now |
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Karl Kruse GmbH & Co KG | DDR3L 8G 512M X 16 1.35V 96-BALL FBGA 933MHZ INDUSTRIAL TEMP (MT41K512M16HA-125IT:A) | 17404 |
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RFQ | |
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DISTI #
AS4C512M16D3LC-10BIN
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Avnet Silica | DRAM Chip DDR3L SDRAM 8Gbit 512M X 16 1.35V 96-Pin FBGA Tray (Alt: AS4C512M16D3LC-10BIN) RoHS: Compliant Min Qty: 190 Package Multiple: 190 Lead time: 1 Weeks, 2 Days | Silica - 0 |
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Buy Now |
Part Details for AS4C512M16D3LC-10BIN
AS4C512M16D3LC-10BIN CAD Models
AS4C512M16D3LC-10BIN Part Data Attributes:
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AS4C512M16D3LC-10BIN
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS4C512M16D3LC-10BIN
Alliance Memory Inc
DDR3L DRAM, 512MX16, CMOS, PBGA96, FBGA-96
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ALLIANCE MEMORY INC | |
| Package Description | FBGA-96 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 8 Weeks | |
| Access Mode | MULTI BANK PAGE BURST | |
| Clock Frequency-Max (fCLK) | 933 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 13 mm | |
| Memory Density | 8589934592 bit | |
| Memory IC Type | DDR3L DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 536870912 words | |
| Number of Words Code | 512000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA96,9X16,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.016 A | |
| Supply Current-Max | 0.36 mA | |
| Supply Voltage-Max (Vsup) | 1.45 V | |
| Supply Voltage-Min (Vsup) | 1.283 V | |
| Supply Voltage-Nom (Vsup) | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 9 mm |