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Overview of BAP64-03/DG/B2/AX by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
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CAD Models for BAP64-03/DG/B2/AX by NXP Semiconductors
Part Data Attributes for BAP64-03/DG/B2/AX by NXP Semiconductors
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|---|---|
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Rohs Code
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Yes
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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NXP SEMICONDUCTORS
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Part Package Code
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SOD
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Package Description
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PLASTIC, SC-76, 2 PIN
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Pin Count
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2
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Manufacturer Package Code
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SOD323
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Reach Compliance Code
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unknown
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Additional Feature
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HIGH VOLTAGE
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Application
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ATTENUATOR; SWITCHING
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Breakdown Voltage-Min
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175 V
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Configuration
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SINGLE
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Diode Capacitance-Max
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0.35 pF
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Diode Capacitance-Nom
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0.48 pF
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Diode Element Material
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SILICON
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Diode Forward Resistance-Max
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1.35 Ω
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Diode Res Test Current
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0.5 mA
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Diode Res Test Frequency
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100 MHz
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Diode Type
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PIN DIODE
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Frequency Band
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S BAND
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JESD-30 Code
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R-PDSO-G2
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Minority Carrier Lifetime-Nom
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1.55 µs
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Number of Elements
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1
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Number of Terminals
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2
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Operating Temperature-Max
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150 °C
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Operating Temperature-Min
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-65 °C
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Package Body Material
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PLASTIC/EPOXY
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Package Shape
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RECTANGULAR
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Package Style
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SMALL OUTLINE
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Power Dissipation-Max
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0.5 W
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Reference Standard
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IEC-60134
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Reverse Test Voltage
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Surface Mount
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YES
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Technology
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POSITIVE-INTRINSIC-NEGATIVE
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Terminal Form
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GULL WING
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Terminal Position
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DUAL
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